In today's era of exploding AI computing power, 5G communication upgrades, and the transition of New Energy Vehicles (NEVs) toward 800V high voltage platforms, heat dissipation and packaging reliability have become core bottlenecks restricting system performance. Aluminum Nitride Ceramic Substrates, with their exceptional thermal conductivity, superior insulation properties, and a Coefficient of Thermal Expansion (CTE) highly matched to semiconductor materials, have become indispensable for high speed optical modules, RF devices and power semiconductors.