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Innovacera Will Showcase Technical Ceramic Solutions at 2025 Laser World of Photonics in Booth A2 464

Innovacera will attend the exhibition of Laser World of Photonics 2025 at June 24-27, Messe München, Welcome visit us at Booth A2 464 to discover how technical ceramic components use in the photonics industry and ceramic solutions engineered for high-power photonics.

Ceramic-to-Metal Sealing

The global photonics industry converges at Laser World of Photonics 2025 – the world’s premier trade fair for photonics technologies. As the definitive industry event, the exhibition anticipates over 40,000 professional visitors from 70+ countries and 1,300+ leading companies showcasing cutting-edge innovations.

Laser World of Photonics 2025

Innovacera Will Display Core Ceramic Components as below in the exhibition:
✅ Ceramic-to-Metal Sealing Components (CTMS)
✅ Metallized Ceramics
✅ DBC/DPC Substrates
✅ Glass-to-Metal Sealing Components (GTMS)
✅ Alumina Ceramic Reflectors
✅ Boron Nitride Part
✅ Precision Ceramic Components

High-power photonics need precision ceramic substrates & hermetic sealing technologies, as laser power densities escalate and devices miniaturize, traditional materials fail to meet stringent demands for thermal management, hermeticity, and reliability. Technical ceramics are widely use in photonics industry because their excellent properties of resistance of high temperature and electrical insulator. Ceramic -to-metal sealing components have good hermetic sealing and DBC(Direct Bonded Copper)/DPC(Direct Plated Copper) substrates have advantages in thermal management for photonics-integrated circuits. Ceramic reflector is widely used for industrial laser cutting and medical laser systems.

Ceramic Components Precision Ceramic Components

If you have any demand of technical ceramic components, welcome to visit our booth and communicate with us to learn more about ceramic part photonics industry application.

Event Details:
Laser World of Photonics 2025
Dates: 24-27 June 2025
Location: Messe München, Germany
Innovacera Booth: A2 464 (Hall A2)

Custom ceramic setters for sintering of Metal Injection Molded MIM parts

In the metal powder injection molding process, metal powder is sintered into a solid shape. In this process, ceramic setters are essential to prevent its deformation during the sintering process and ensure the dimensional stability of the metal part. MIM can mass-produce small-sized parts (usually less than 50 mm) with complex geometries. Custom aluminum oxide sintering setter optimizes the sintering process by ensuring even heat distribution and minimizing part contamination.

Advantages of High-Purity Alumina Ceramic Setters/Sintering Trays or Plates

1.High Thermal Resistance
Aluminum oxide sintering setter has good high-temperature stability, which is mainly due to its high melting point, high thermal conductivity and good thermal shock resistance. In the sinter process, it can reduce setter thickness to improve energy utilization. So we can use it as a sintering tool for stainless steel, tungsten and other refractory alloys.

2.Inert surfaces
Alumina ceramic setters are chemically inert and don’t react with metals or sintering environments (such as argon, hydrogen or vacuum), it is preventing contamination and maintaining metal component purity. As a result, these setsters also have a long service life without repair.

3.Low Thermal Expansion
Alumina’s low coefficient of thermal expansion reduces size changes when cooling and heating, ensuring consistent metal components geometry and reducing the risk of cracking.

4.Surface Roughness
Innovacera can customize the surface roughness of alumina ceramic setters, a general surface roughness of Ra < 0.4–1.6 µm reduces sticking between the setter and MIM parts. A particle-free surface also protects metal parts from contamination from the setters.

5.Mechanical Strength
Alumina setters have high compressive strength, which enables it to withstand heavy loads without deformation. Its wear resistance also prolongs its service life and reduces replacement frequency. The service life is about 50-200 cycles (depending on thermal shock.

High-purity Alumina Setters Applications in MIM Sintering
-High-purity alumina setters are used in sintering:
-Aerospace components (e.g., nickel-based superalloys)
-Medical implants (e.g., titanium orthopedic components )
-Automotive parts (e.g., gears and fuel injectors)
-Electronics (e.g., copper heat sinks)

INNOVACERA produces a series of custom and standard ceramic setters, and it is made of alumina ceramic, aluminum nitride ceramic and boron nitride ceramic. If you need any ceramic setter, please feel free to contact us.

How do metalized ceramic bushings apply in 5G communication

As 5G communication development, the requirement for its core parts is becoming more and more strict. Electronic filter as the core component of communication equipment, continuously improving the technology, as one of the main important parts in filters is metalized ceramic parts.

Innovacera provides customized and common metalized ceramic parts for filters, one of the common parts is metalized ceramic bushings.

What’s the function of metalized ceramic bushings in Filters

1.Feedthrough Capacitor Filters
Metalized ceramic bushings are commonly integrated into feedthrough capacitor filters to suppress electromagnetic interference (EMI) and radio frequency interference (RFI) in electronic circuits. The filters are mostly installed on bulkheads, enclosures, or metal cases of sensitive electronic devices.
In this application:

– The metalized ceramic bushing provides electrical insulation between the inner conductor and the metal case.
– The metalized layer provides good adhesion when brazing or soldering ceramic to the metal, ensure a hermetic seal.
– The ceramic bushing can block high-frequency noise when the central conductor is passed through it, forming a coaxial structure that helps maintain signal integrity.

2.Hermetic Filter Assemblies
In aerospace, military, medical, and telecom environments where both EMI shielding and hermeticity are required, metalized ceramic bushings serve as the interface between the internal filter elements and the metal housing. These assemblies are often used in:

– EMI/RFI filtered connectors
– Power line filters
– Signal line filters

The ceramic bushing allows the internal electrical elements to connect externally while:
– Preventing moisture, gases, or contaminants from entering the sealed enclosure
– Maintaining high dielectric strength to prevent voltage breakdowns

3.High-Voltage Filters
In high-voltage filter systems, such as those found in power electronics, radar systems, and medical imaging equipment, metalized ceramic bushings provide critical isolation and mechanical support. They ensure that high-potential conductors are securely and safely passed through grounded filter housing.

Therefore, metalized ceramic bushings are the indispensable components that has been applied in electrical, mechanical, and sealing interfaces. Whether used in EMI feedthrough filters, hermetic filter connectors, or high-voltage filter assemblies, they ensure safe signal or power transfer while maintaining electrical isolation, shielding integrity, and environmental protection.

When is Hermetic Sealing Required?

How to prevent moisture or gas penetration while enabling electrical or optical signal transmission; and how to protect sensitive optoelectronic components from environmental influences. These are common challenges faced during the design process.

This is when the “hermetic packaging” technology, which has been in mature use for decades, comes into play. It can achieve signal and power transmission while maintaining air-tightness. Hermetic packaging is also used for optical signal transmission. For example, vacuum – sealed optical lenses or flat – window tube caps are often used in the packaging of sensors.

The two transmission functions of hermetic packaging are electrical signal transmission and optical signal transmission.

– Electrical Power/Signal Transmission: Hermetically sealed connectors can conduct through the sealed housing while preventing the intrusion or escape of moisture, gas and other substance.

– Optical Signal Transmission: Hermetically sealed lens or caps allow the emission or transmission of optical signals.

Hermetic packaging comes in various forms, including electrical package, cable feedthroughs, connectors, joints or conductor terminals, etc.

What are the application cases of hermetic packaging and what functions do they serve?

1.Meeting the Challenges of Extreme Environments

Hermetic packaging can protect electronic devices to operate stably in specific environments, such as high temperature, high pressure, humid and corrosive environments.

Product Performance Indicators:
– Prevent moisture and gases. (Helium leakage < 10⁻⁸ mbar·l/s)
– Resist high and low temperatures.Temperature range: -200°C ~ 1000°C, for example, it can be applied in the cryogenic LNG industry and automotive exhaust gas sensors.
– Withstand high pressure. Withstand up to 400 MPa of high pressure and can be used in oil and natural gas exploration.
– Resist chemical corrosion and radiation, and tolerate the electrolyte of lithium – ion batteries and nuclear radiation.

2.Enhancing System Reliability and Safety
In addition to challenging working environments, hermetic sealing can extend the service life and improve the efficiency of products. For example, applications that are not convenient for replacement and maintenance, or where the maintenance cost of the electrical system is too high – aviation, aerospace and maritime applications.

3. Improving Performance, Efficiency, and Design Innovation
Hermetic packaging can also significantly enhance performance, efficiency, and design innovation. In optical communication and data communication applications, a truly airtight or waterproof enclosure is required to achieve long – term, stable, and high – performance data transmission.

Hermetic packaging can also be a cost – effective alternative to non – sealed or quasi – sealed solutions because it can be combined with more miniaturized and simplified single – component designs instead of large and complex multi – component systems. Through special designs, hermetic packaging can also meet special data transmission requirements such as heat dissipation, high – power/voltage/insulation, or high – RF optical signals.

4.High Cost – Performance and Widely Used in Automotive and Home Appliance Electronics

The production process of hermetic packaging products is highly mature, capable of providing a large number of products with stable quality and having a competitive price. It has been applied in various industries. For example, the hermetic tube seats of automotive airbags and seat belts have extremely high reliability and meet the 0 PPM quality control requirements. In the home appliance industry, hermetic terminal blocks provide stable power supply for refrigerator and air – conditioner compressors.

The basic purpose of vacuum sealing and hermetic packaging is to assist in the reliable operation of electronic devices and systems – – especially in some extremely harsh application scenarios. It is widely used in many important industries, including automotive electronics, nuclear safety, medical equipment, etc., and the product quality is trustworthy. As the only viable solution for electronic protection, hermetic packaging increases product value, meets customer requirements, and is used in various industries and daily consumer electronics.

Precision Quadrupole Mass Filter-Core Component Of Mass Spectrometer

As the core component of the mass spectrometer, the quadrupole mass filter achieves ion screening through precise electric field control. The quadrupole is usually composed of four parallel metal rods, and two pairs of electrodes apply: direct current voltage (DC, U) and radio frequency voltage (RF, V·cos(ωt)). By adjusting the DC and RF voltages, ions with a specific mass-to-charge ratio (m/z) can be selected to pass through, while other ions are filtered out.

Picture 2: The structure of the quadrupole mass analysis device and the schematic diagram of the applied voltage.

supplementary instruction: “U” is the maximum DC voltage on the quadrupole electrode, and “V” is the maximum RF AC voltage on the electrode.

Typical quadrupole mass analyzers are divided into hyperbolic quadrupoles and cylindrical quadrupoles, which are described in detail as follows:

Hyperbolic quadrupole:
• Four sets of precision hyperbolic electrodes form an ideal electric field space
• 45-degree asymptotic line symmetry design to ensure electric field uniformity
• 180° inverted RF signal loading to achieve high-resolution ion selection
• Aerospace-grade material processing technology, tolerance control up to micron level

Cylindrical quadrupole:
• Innovative cylindrical electrode design reduces processing costs
• Patented size ratio (r/r0=1.12-1.13) to maintain field accuracy
• High-precision centerless grinder processing, straightness error <5μm
• Length 100-300mm optional, customized services available

Please kindly note: Innovacera mainly provides customized services for cylindrical quadrupole rods.

Material selection:
• LC-MS: Special ceramic/quartz material, thermal expansion coefficient <0.5×10⁻⁶/℃
• GC-MS: 316 stainless steel/molybdenum alloy, corrosion resistance increased
• Surface coating technology prolongs service life.

As the core component of mass spectrometers, our quadrupole products are widely used in environmental testing, pharmaceutical analysis, food safety and other fields.

Innovacera has a professional customized R&D team. If you have quadrupole components inquiry and drawings, please contact us with no hesitation!

Innovacera Invites You to Meet Us at SEMICON Southeast Asia 2025 – Hall B1, Booth #L1121

Join Innovacera at SEMICON Southeast Asia 2025, Asia’s premier semiconductor industry event, where we will show our advanced precision ceramic components engineered to revolutionize semiconductor manufacturing.

SEMICON Southeast Asia 2025
Dates: May 20-22, 2025
Location: Sands Expo and Convention Centre Singapore
Booth: Hall B1, #L1121

Semicon southeast asia 2025 expands the coverage of the global electronics manufacturing supply chain! While Southeast Asia is rising up fast as a world-class electronics manufacturing hub with end-to-end R&D capabilities – SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products and brings in the most up-to-date market and technology trends. Bringing solutions to industry challenges that can best be addressed at the event!

May 20th, The Singapore SEMICON Southeast Asia 2025 is set to commence with grandeur! At this event, we show a series of precision ceramics plays a very important role in fields such as chip manufacturing, packaging and testing, and equipment manufacturing in the semiconductor field.

-Ceramic metallization, ceramic to metal sealing components, and hermetic feedthroughs, designed to withstand extreme thermal, mechanical, and electrical challenges in semiconductor environments.

-Aluminum Nitride (AlN) Ceramics including the hot pressed AlN ceramics and general aluminum nitride ceramic components which is widely used in wafer processing and power modules, LED chip packaging.

-Alumina Components such as robots arm ceramic end effector, Alumina Ceramic parts are used for rotating parts in photo-lithography machines and in a vacuum state. This requires extremely high machining accuracy, and the run-out of the inner circle is required to be within 2 microns.

With over 10 years of experiences in advanced ceramics and semiconductor industry, Innovacera team specializes in technical ceramic solutions in semiconductor industry, from prototyping to mass production, ensuring your specifications for dimensional accuracy, material properties, and performance are met.

See You at Hall B1 #L1121!

Innovacera Invites You to Meet Us at Ceramic Japan 2025 – Hall 4, Booth 19-26

The ceramics industry is evolving rapidly, Innovacera is at the forefront of this transformation. We are excited to announce our participation in Ceramic Japan 2025, the premier international exhibition for advanced ceramics, Japan’s Largest Fine Ceramics Show! The event will be held from May 14-16, 2025 at INTEX Osaka. . Join us at Hall 4 19-26 to learn more us in ceramic materials, manufacturing technologies, and industrial applications.

Ceramic Japan is the leading ceramic exhibition that gathers fine ceramics (structural materials, functional materials, biomaterials, refractories), ceramic raw materials (oxides, phosphors, nitrides, carbides), manufacturing and processing technologies, and more. Held twice a year in Osaka and Tokyo, attendees can expect to be immersed in a wide spectrum of powder technologies, coating technologies, ceramic processing technologies, and ceramic materials, from traditional to contemporary.

Innovacera provides technical ceramic solutions and ceramic materials such as aluminum oxide, boron nitride, aluminum nitride, zirconia, silicon nitirde. As a leading manufacturer of advanced ceramic components, supply metallized ceramics, ceramic to metal, ceramic heaters, and other customized components for industries including semiconductor, electronics, automobiles, medical and so on. Innovacera serves more than 1,000 customers globally and products are rohs and reach certified. Innovacera’s factory is ISO9001:2015 and IATF16949 certified.

Here are some Innovacera product introduction:
1.Alumina ceramic, which is an excellent electrical insulator and one of the most widely used advanced ceramic materials. In addition, it is extremely resistant to wear and corrosion and is an industrial ceramic that can only be formed by diamond grinding. Alumina components can be widely used in electronics, pump components and automotive sensors.

2.Aluminum nitride, with its properties of electrical insulation and excellent thermal conductivity, aluminum nitride (AIN) ceramics is ideal for applications where heat dissipation is required. AlN offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components.

3. Boron nitride ceramics, hexagonal boron nitride has a microstructure similar to that of graphite. in both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (hbn) or white graphite, widely used for molten aluminum and sintering silicon nitride.

4.Ceramic heater, Innovacera’s ceramic heaters are manufactured using advanced high-purity ceramic materials, offering excellent high-temperature resistance, corrosion resistance, and thermal stability. Compared to traditional metal heaters, ceramic heaters deliver more efficient and stable heating performance in extreme environments.

5.Hermetically sealed product-Innovacera offers clients ceramic-to-metal and glass-to-metal components. Ceramic-to-metal sealing products not only have the characteristics of ceramic high temperature resistance, corrosion resistance, but also have the strength and toughness of metal. They are widely used in electronic aerospace, medical industry and other applications.

Innovacera is committed to pushing the boundaries of ceramic technology. Visit us at Hall 4 19-26 to experience our solutions firsthand or schedule a meeting in advance at sales@innovacera.com.

See you at Ceramic Japan 2025, for more details, welcome to visit our website at www.innovacera.com, and contact us with 86-592-5589730.

Ceramic Packages For Semiconductor Discrete Device Power Electronics

Innovacera develops ceramic packages and metal packaging shells to meet customer customized requirements. Innovacera’s factory has established robust capabilities in the research and development of ceramic and glass materials, tape casting for green ceramics, microwave/RF simulation, packaging technologies including the ceramic packaging shells/substrates, brazing/sealing, and surface treatment processes, offering customers comprehensive and integrated packaging solutions.

Innovacera offers ceramic packages for semiconductor discrete device power electronics by using ceramic-to-metal sealing technologies. Ceramic packages adopt a ceramic sidewall structure instead of the traditional bead-type insulated ceramic design, significantly improving the voltage withstand performance of the housing. Copper-cored kovar lead pins and WCu heat sinks are bonded onto multilayer alumina ceramic packages or aluminium nitride ceramic packages. It is primarily used for encapsulating high-power transistors, diodes, triodes, and power modules.

Ceramic Packages Current Carrying Capacity:

Typical TO-Style Package
Package Model	TO-254	TO-257
Plating Structure	Ni+Au	Ni+Au
Heat Sink Material	WCu	WCu
Ceramic Size (mm)	9.6×9.6	7.5×6.0

Lead Diameter	Lead Material	Max. Current Capacity
1.0mm	Copper-cored Kovar	20A max
0.8mm	Copper-cored Kovar	15A max
1.0mm	Copper	60A max
0.8mm	Copper	45A max

Ceramic Packages Features:

Heat Sink Materials: WCu, CPC, CMC, etc.
Lead Materials: Copper-cored Kovar, copper.
Insulation Resistance: 1010Ω(500V)
Withstand Voltage: > 1000V.
Leak Rate: ≤1×10³Pa ·cm³/s
Plating Options: Full nickel plating, full Ni/Au plating.
Sealing Method: Parallel seam welding.
Temperature Cycling: -65℃~+175℃, 500 cycles.

If you have interesting about power electronics and semiconductor discrete device ceramic packages, welcome to contact Innovacera sales team at sales@innovacera.com.

Hermetic Micro Rectangular Connector For Sealing Solution

INNOVACERA hermetic micro rectangular connector utilize high-performance glass materials to achieve hermetic sealing between metal housings and electrical contacts, enabling circuit interconnections across cables in electrical/electronic systems, between cables and instrumentation devices, and with printed circuit boards (PCBs). These connectors ensure stable transmission of both low-frequency and high-frequency signals, as well as electrical currents.

Hermetic micro rectangular connector is multipin connector, featuring a glass-sintered dielectric structure with standardized 1.27mm contact spacing, the terminal interfaces accommodate wire cores with 0.1- 0.15 mm2 cross-sectional areas while supporting direct soldering to PCBS. According to engineered for environments demanding stringent hermetic sealing requirements, these micro rectangular connectors integrate miniaturized construction, lightweight design, and high-reliability contacts. Their exceptional electromagnetic shielding performance, coupled with superior vibration and impact resistance, makes them ideal for mission-critical applications such as aerospace systems, precision instruments, and other electronic systems requiring advanced hermetic protection.

Micro Rectangular Connector Contact Arrangements:

Technical advantages
Air tightness level: ≤1.0×10-9Pa·m3/s;
Insulation resistance: ≥1000MΩ;
Dielectric withstand voltage: ≥500V.

Features:
Hermetically Sealed by Sintered Glass
Contact Spacing:1.27 mm (0.05″)
Wire size:0.1-0.15 mm2
Raw options: 1-2
Contacts: 5-41
Space and weight saving.
Excellent resistance to shock and vibration.
The end can be soldered directly to PCB

If you need any hermetically sealed connectors such as micro rectangular connector, micro D connector these micro sealed connectors, welcome to contact Innovacera team at sales@innovacera.com.

Ceramic grinding media balls

Innovacera develops all kinds of ceramic grinding media balls such as silicon nitride grinding balls, alumina ceramic grinding balls, zirconia grinding media balls which are a important grinding media in the industrial production and laboratory research. Ceramic grinding media, ceramic grinding balls also call ceramic grinding beads, ceramic grinding media or ceramic grinding bodies which is widely use in the fields need better grinding, polishing, and mixing processes.

Ceramic Grinding Media Balls Features:

Effectively crushes and refines materials
High grinding efficiency
Abrasion is very low
Outperforms in durability compare to traditional grinding media
Maintaining shape and dimensional stability over extended periods.
High Chemical Stability
Low Contamination
Generates minimal harmful substances during grinding

Ceramic Grinding Media Balls Applications:

Ultra-fine grinding and dispersion of high-purity powders, such as silicon nitride ceramic powder.
Pharmaceutical
Aerospace
Metallurgy and Mining
Laboratory Research
Grinding and dispersing high-hardness materials, such as quartz.
Electronics
Optics
Coatings and Paints
Cosmetics

Ceramic Grinding Media Balls Material Properties Comparison:

Ceramic Grinding Media Balls Performance Comparison:

ZrO₂	Al₂O₃	Si₃N₄	SiC
zirconium oxide (ZrO2)， yttria (Y2O3)	aluminium oxide ( High Purity）	silicon nitride (Si3N4)	silicon carbide (SiC)
6.0 g/cm³	3.75-3.95 g/cm³	3.2 g/cm³	3.0 – 3.2 g/cm³
low, 2-3 W/m·K	middle，20-30 W/mK	15 – 50 W/mK	high, 100–120 W/m·K
5-6 kgs/Ton	Very High	Low	Very Low
Used in various grinding processes such as ball milling and abrasive wear, which require high wear resistance and minimal contamination, including applications in ceramics, pigments, pharmaceuticals, and cosmetics.	As grinding media in ball mills, Chutes, pipelines, and pump impellers. Thermocouple protection in furnaces.	Request hard material grinding and high-temperature grinding processes, high wear resistance, such as in silicon nitride ceramic powder, metal processing in the automotive industry.	Metal precision finishing, ceramic grinding, and glass cutting.

Ceramic Grinding Media Balls Sintering Way Comparison:

	Gas Pressure Sintering (GPS)	Hot Isostatic Pressing Sintering (HIP)
Sintering Condition	Temperature: 1800–1900℃	Temperature: 1800–1900℃
Sintering Condition	Sintering atmosphere pressure: 10 MPa	Sintering atmosphere pressure: 200 MPa
Degree of Densification	Residual minor porosity (99.2%)	Near full densification (99.8%)
Performance Indicators	Meet Grade II–III Ball Standards	Performance indicators and fatigue life are significantly improved compared to GPS.
ASTM F2094-2011 (USA)	Grade III	Grade I, II
Grade	Medium–Low Pressure Ceramic Balls	High-End Ceramic Balls
Remarks	Technology predominantly used domestically	Commonly adopted internationally, but with high costs, not suitable for large-scale industrial production.

Ceramic Grinding Media Balls Production Process:

Ultra-fine High-purity Silicon Nitride Powder, Sintering Aids, Additives → Homogeneous Mixing → Spray-dried Granules → Cold Isostatic Pressing (CIP) → Green Body Machining → Sintering (Isostatic Pressing (HIP) or Gas Pressure Sintering (GPS))→Balls Blank Inspection→Coarse Grinding, Precision Grinding, Ultra-fine Processing.

If you need the ceramic grinding media balls such as silicon nitride grinding ball, alumina and zirconia ceramic media balls, contact us Innovacera team at sales@innovacera.com.