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Boron Nitride Ceramics

Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite.

Boron Nitride Ceramics

Material of Boron Nitride Ceramics

  • Pyrolytic Boron Nitride: 99.99% Boron Nitride*
  • 99 Boron Nitride: Boron Nitride + Boric Oxide (B2O3)
  • CABN: Boron Nitride + Calcium Borate
  • ALBN: Boron Nitride + Al2BO3
  • ZRBN: Boron Nitride + Zirconium Oxide + Boric Oxide (B2O3)
  • ZABN: Boron Nitride + Zirconium Oxide + Aluminum Nitride + Al2BO3
  • SCBN: Boron Nitride + Silicon Carbon + Al2BO3

Processing of Boron Nitride Ceramics

  • Hot Pressed Sintering
  • Chemical Vapor Deposition

Applications of Boron Nitrides Ceramics

  • Thermal Management
    Excellent electrical insulation and thermal conductivity make BN very useful as a heat sink in high-power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide, and other electronic packaging materials, and are easier machinable to desired shapes and sizes.
  • High Temperature Environments
    Temperature stability and excellent resistance to thermal shock make BN the ideal material in the toughest high-temperature environments such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing.
  • Molten Metal Handling
    BN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes.

Comparison of Boron Nitride Ceramics

Grade BN997 BN99 BN-SI BN-AL BN-SIC BN-ZR BN-ALN
Main Composition BN>99.7% BN>99% BN+AL+SI BN+ZR+AL BN+SIC BN+ZRO2 BN+ALN
Bonding Composition B2O3 B2O3 Boron oxide silicon Boron oxide aluminum Boron oxide aluminum B2O3 Boron oxide aluminum
Density (g/cm3) 1.6 2 2.2-2.3 2.25-2.35 2.4-2.5 2.8-2.9 2.8-2.9
Room Temperature Electric Resistivity (Ω·cm) >1014 >1014 >1013 >1013 >1012 >1012 >1013
Max Using Temperature (℃)
In Atmosphere
In Inactive Gas
In High Vacuum (Long Time)
900
2100
1800
900
2100
1800
900
1750
1750
900
1750
1750
900
1800
1800
900
1800
1800
900
1750
1750
Three-Point Bending Strength (MPA) 18 35 65 65 80 90 90
Compressive Strength (MPA) 45 85 145 145 175 220 220
Thermal Expansion Coefficient (20-1000℃)
(10-6/K)
1.5 1.8 2.0 2.0 2.8 3.5 2.8
Thermal Conductivity (W/m·k) 35 40 35 35 45 30 85
Typical Application: High Temperature Furance High Temperature Furance Powder Metallurgy Powder Metallurgy Powder Metallurgy Metal Casting High Temperature
Equipment
High Temperature Electrical Furnace Components (High Temperature Insulator Sleeve Tube etc) Y Y Y Y Y Y
Metal Vaporize Crucible Y Y
The Container Of Metal or Glass Melting Y Y Y Y Y Y Y
The Casting Mould Components Of The Precious Metal And Special Alloy. Y Y
High Temperature Support Part Y Y Y
Nozzle And Transport Tube Of The Melting Metal Y Y Y Y Y Y
Remark: The value is just for review, different using conditions will have a little difference.
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