INNOVACERA

technical ceramic solutions

Production

Metallization

Aluminum oxide, Aluminum nitride and Beryllium oxide are some common materials we metallized. After metallization, a thin or thick metal coating is applied to the metallized layer to improve its wettability, preparing the substance for subsequent brazing operations. These components are widely used in a variety of industries.

Innovacera offers precision metallized ceramic components for the military, medical, electrical and aerospace industries.

Descriptions of Metallization Processing

Metallization Processing
(See Process Description Below)
Outer Diameter and Inner Diameter Banding
Brush
Screen Printing
Spray
Needle
Base Metallization Materials Moly Manganese
Tungsten Manganese
Moly Tungsten Manganese
Materials for Metallization Aluminum Oxide
Beryllium Oxide (Restrictions Apply)
Metallization Characteristics/Benefits Low Temperature Firing
Universally Applicable
Process Speed
Uniform Coating, Thickness and Density
No substrate deformation
Metallization Equipment Domestic Furnaces
Industry Focus Department of Defense
Department of Energy
Solar Product Manufacturing
Aerospace
Biomedical
Communications
Computer and Electronics
Vacuum Electronics
Medical
Military
Semiconductor
Optical
Intended Applications for Metallization Products Traveling Wave Tubes
Vacuum Electronic Devices
Medical Devices
Photon Machines
Neutron Generators
X-Ray Tubes
Klystrons
High Vacuum Feed Through
Relay Insulators
E-Beam Technology

As requested, we provide various kind of metallization as below:

Thick Film Ceramic Substrate
This product is widely used in circuit substrates for optical storage, optical communication, RF application, LED and various other uses.

Thin Film Ceramic Substrate
This product is widely used in circuit substrates for optical storage, optical communication, RF application, LED and various other uses.

High Temperature Co-fired Substrates (HTCC)
This product achieves a variety of products with high reliability, high density, and multifunction. It is used in ceramic heater, optical/power element package, and sensor package.

Direct Bond Copper(DBCu)
This product is mainly used in applications of medium and lower output areas, such as general power electronics,concentrated photovoltaics (CPV), Peltier elements,semiconductor modules for automotive applications.