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Ceramic Small Outline Package (CSOP)

The Ceramic Small Outline Package (CSOP) is a high-reliability ceramic IC packaging solution designed for miniaturized electronic systems that demand excellent mechanical strength, thermal stability, and electrical performance. Manufactured using advanced ceramic processing and precision metallization technology, CSOP packages provide superior protection and stable interconnection for integrated circuits operating in harsh and demanding environments.

Ceramic Small Outline Package (CSOP)

Compared with conventional plastic packages, ceramic small outline packages offer lower thermal expansion mismatch, enhanced hermeticity, and improved resistance to mechanical shock and vibration. Their compact outline and wing-shaped leads make them ideal for high-density PCB assembly while reducing stress on solder joints.

Technical Specifications

Category Item Code Common Standards Tolerance Special Dimensions Tolerance
External Structure Length L 5~75 ±1% 2~100 ±0.6%
Width W 5~75 ±1% 2~100 ±0.6%
Thickness H 0.8~4.0 ±3% 0.4~5.0 ±2%
Single-layer Thickness h 0.12,0.15,0.20,0.25 ±0.02 0.1 ±0.01
Internal Structure Hole Diameter Φp1 0.13,0.17,0.20,0.25,0.30,0.34,0.42 ±0.01 0.08,0.10 ±0.01
Hole Spacing s1 3Φp1 min
Distance from Hole to Edge s2 3Φp1 min
Pad Φp2 Φp1+0.1 Φp1+0.05
Side Hole R 0.17,0.21,0.25,0.30 Other Specified Requirements
Hole Spacing s3 3R min
Via Position Deviation s4 ±0.02 ±0.015
Metallization Line Width A 0.08min ±20% 0.05min ±10%
Line Width >0.10 ±0.02 >0.10 ±0.01
Line Spacing B 0.08min ±20% 0.05min ±0.01
Line Spacing >0.10 ±0.02
Distance from Pattern to Edge C 0.20min 0.00

 

Features

• Miniaturization, wing-shaped leads, low mechanical stress
• Excellent resistance to mechanical impact and vibration
• High dimensional accuracy and stable metallization
• Suitable for high-density PCB assembly
• Multiple lead pitches available, such as 1.27 mm, 1.00 mm, 0.80 mm, etc

Applications

• Packaging of various integrated circuits (ICs)
• High-reliability electronic components
• Aerospace and defense electronics
• Industrial control systems
• Medical and precision instrumentation

Standard Product Models

Product Model Number of Leads Lead Pitch (mm) Cavity Size (mm) External Dimensions (mm) Sealing Type
CSOP04-01 4 2.54 2.60*2.30 5.40*4.00 Flat Sealing
CSOP08-02 8 1.27 2.74*3.00 5.00*4.40
CSOP14-03 14 1.27 4.50*2.40 9.00*6.00
CSOP16-02 16 1.27 1.60*2.20 10.50*5.40
CSOP16D 16 1.27 5.00*3.00 10.50*7.50
CSOP20-01 20 1.27 6.00*4.00 12.70*7.50
CSOP20-02 20 0.65 2.80*2.80 6.60*5.50
CSOP24-03H 24 0.65 4.60*2.00 8.60*6.30
CSOP32-02 32 1.27 12.00*9.70 20.47*12.70
CSOP56-01 56 0.8 10.80*10.30 27.30*13.30
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