Ceramic DIP enclosures are widely used in aerospace, military, telecommunications, medical electronics, and industrial control applications. Compared with plastic packages, ceramic DIP enclosures provide superior heat dissipation, enhanced electrical insulation, and resistance to high temperatures, humidity, and chemical corrosion. Multiple lead counts, cavity sizes, and sealing options are available to support diverse circuit designs and packaging requirements.
Features
• Dual In-line Leads
• Wide range of lead counts
Applications
• Suitable for various integrated circuits with moderate lead-out
requirements and assembly density
• Optocoupler devices,MEMS(Micro-Electro-Mechanical
Systems),etc
| Product Model | Number of Leads | Lead Pitch (mm) | Cavity Size (mm) | External Dimensions (mm) | Sealing Type |
| DIP04D | 4 | 2.54 | 5.40×3.20 | 7.40×5.20 | Flat Sealing |
| DIP06J | 6 | 2.54 | 6.60×5.40 | 8.40×7.40 | Flat Sealing |
| DIP08 | 8 | 1.27 | 5.60×4.20 | 13.20×7.40 | Flat sealing/Gold-Tin |
| DIP08CA | 8 | 2.54 | 7.70×5.40 | 9.70×7.70 | Flat Sealing |
| DIPO8HA | 8 | 2.54 | 3.35×5.40 | 9.70×7.70 | Flat Sealing |
| DIP16 | 16 | 2.54 | 5.60×4.32 | 20.33×7.37 | Flat Sealing |
| DIP20 | 20 | 2.54 | 5.60×3.80 | 25.14×7.34 | Flat Sealing |
| DIP32 | 32 | 2.54 | 10.00×6.20 | 40.64×9.91 | Gold-Tin |
| DIP40 | 40 | 0.8 | 10.20×10.20 | 50.80×15.00 | Flat sealing/Gold-Tin |
Technical Specifications
The Ceramic Dual In-line Package (DIP) Enclosure is engineered to deliver excellent electrical and thermal performance for high-reliability electronic applications. Its ceramic body ensures stable signal transmission, strong mechanical integrity, and effective heat dissipation, making it suitable for both standard and high-frequency devices.
Features
• High electrical conductivity and current-carrying capacity
• Large-area heat sink in the chip bonding area
• Reliable performance and good heat dissipation
Applications
• Microwave Device Enclosure
• Enclosures for Crystal Oscillators and Crystal Oscillation
Devices
| Product Model | Number of Leads | Cavity Size (mm) | External Dimensions (mm) | Sealing Type | Whether it includes a heat sink |
| SMD-0.1 | 2 | 2.60×2.60 | 6.00×3.50 | Flat Sealing | Yes |
| SMD-0.2 | 3 | 3.00×3.20 | 7.95×5.50 | ||
| SMD-0.3 | 2 | 4.50×4.50 | 8.00×6.00 | ||
| SMD-0.5 | 3 | 4.05×5.4 | 10.20×7.50 | ||
| SMD-1 | 3 | 8.60×8.60 | 15.90×11.38 | ||
| SMD-2 | 3 | 10.00×9.60 | 17.52×13.23 | ||
| SMD-2H | 3 | 8.10×9.80 | 17.60×13.40 |
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