Manufactured using advanced ceramic processing technologies, ROSA/TOSA enclosures ensure long-term reliability under harsh operating conditions. Their structure is tailored to meet the requirements of optical chip mounting, signal transmission, and external assembly, making them an ideal solution for next-generation optical modules.
Features
• High hermeticity and high reliability
• Meets the application rate requirements for multiple frequencies ranging from 10 GHz to 400 GHz
• Can be customized and developed according to customer requirements
Applications
• In the field of fiber optic communication
• Various optoelectronic emission and reception devices
• Optical switches and other devices and modules,as well as high-
power lasers
Structural Design
According to the requirements for chip mounting and external installation.
The reliability meets the requirements of international standards.
Product Advantages
Excellent Hermetic Sealing
The ceramic enclosure provides superior hermeticity, effectively protecting sensitive optical and electronic components from moisture, contaminants, and environmental stress.
High-Frequency Performance
Designed to support high-speed signal transmission, the enclosure meets the performance requirements of optical communication systems operating from 10 GHz up to 400 GHz.
Thermal and Mechanical Stability
Advanced ceramic materials ensure low thermal expansion, high heat resistance, and strong mechanical integrity, enabling stable operation over long service lifetimes.
Customization Capability
Dimensions, metallization patterns, pin layouts, and structural configurations can be customized to match specific ROSA/TOSA module designs and customer requirements.
Compatibility with Optical Assembly Processes
Suitable for chip attachment, wire bonding, laser welding, and optical alignment processes commonly used in optical communication device manufacturing.
Typical Use Scenarios
ROSA (Receiver Optical Sub-Assembly) packages
TOSA (Transmitter Optical Sub-Assembly) packages
Optical transceivers and transponders
High-speed optical communication modules
Integrated optoelectronic devices
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