Innovacera Hot pressed ALN ceramic components purity is 99.5% aluminum nitride and its density is about 3.3g/cm3. The thermal conductivity is 140-170 W/(m·k). The forming way of hot-pressed aluminum nitride ceramics is vacuum hot pressing sintering.
After high temperature and high pressure, hot pressed ALN ceramic part mechanical strength and hardness are better than the tap-casting molding process and cold isostatic press method.
Innovacera can provide the maximum size of hot-pressed aluminum nitride ceramic part is Length 500 x width 500 x height < 350 mm and Outer diameter 500 x height < 500 mm
Hot- Pressed aluminum nitride ceramics material properties:
| ITEM | UNIT | Testing Value |
| Hardness | Kgf/mm2 | 1070 |
| Density | G/cm3 | 3.3 |
| Fracture Toughness | Mpa.mg | 2.4 |
| Thermal Conductivity | W/m.k | 140 |
| Flexural Strength | Mpa | 440 |
| Characteristic Strength | Mpa | 450 |
| Coefficient Of Thermal Expansion | X10-6/°C | 5 |
| Dielectric Constant @1MHZ | 9 | |
| Loss Tangent@1MHZ | 0.00029 |
Hot- Pressed aluminum nitride ceramic components features:
- Excellent thermal conductivity
- High electrical insulation
- High dielectric strength
- Resist high temperature and corrosion
- Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors
- Suit for rigorous or abrasive environments
- Can’t be eroded by all kinds of molten metals and molten hydrochloric acid.
Hot- Pressed aluminum nitride ceramic part application:
- Semiconductor heaters
- Magnetic resonance imaging equipment
- Etching machine
- Integrated circuit part
- Structural packaging materials
- High-power heat dissipation insulating substrates
- Microwave window materials
- Compound semiconductor single crystal growth crucible
Innovacera can provide Hot Pressed Aluminum Nitride (HPALN) as customized size and welcome to send your inquiry for us.
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