Innovacera Hot pressed ALN ceramic components purity is 99.5% aluminum nitride and its density is about 3.3g/cm3. The thermal conductivity is 140-170 W/(m·k). The forming way of hot-pressed aluminum nitride ceramics is vacuum hot pressing sintering.
After high temperature and high pressure, hot pressed ALN ceramic part mechanical strength and hardness are better than the tap-casting molding process and cold isostatic press method.
Innovacera can provide the maximum size of hot-pressed aluminum nitride ceramic part is Length 500 x width 500 x height < 350 mm and Outer diameter 500 x height < 500 mm
Hot- Pressed aluminum nitride ceramics material properties:
| ITEM | UNIT | Testing Value |
| Hardness | Kgf/mm2 | 1070 |
| Density | G/cm3 | 3.3 |
| Fracture Toughness | Mpa.mg | 2.4 |
| Thermal Conductivity | W/m.k | 140 |
| Flexural Strength | Mpa | 440 |
| Characteristic Strength | Mpa | 450 |
| Coefficient Of Thermal Expansion | X10-6/°C | 5 |
| Dielectric Constant @1MHZ | 9 | |
| Loss Tangent@1MHZ | 0.00029 |
Hot- Pressed aluminum nitride ceramic components features:
- Excellent thermal conductivity
- High electrical insulation
- High dielectric strength
- Resist high temperature and corrosion
- Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors
- Suit for rigorous or abrasive environments
- Can’t be eroded by all kinds of molten metals and molten hydrochloric acid.
Hot- Pressed aluminum nitride ceramic part application:
- Semiconductor heaters
- Magnetic resonance imaging equipment
- Etching machine
- Integrated circuit part
- Structural packaging materials
- High-power heat dissipation insulating substrates
- Microwave window materials
- Compound semiconductor single crystal growth crucible
Innovacera can provide Hot Pressed Aluminum Nitride (HPALN) as customized size and welcome to send your inquiry for us.
Declaration: This is an original article of INNOVACERA®. Please indicate the source link when reprinting: https://www.innovacera.com/product/hot-pressed-aluminum-nitride
Frequently Asked Questions
Why choose hot-pressed aluminum nitride (HP-AlN) over tape-cast ceramics? How does vacuum hot pressing enhance performance?
Vacuum hot pressing combines high temperature and uniaxial pressure to achieve 99.5% theoretical purity and a dense microstructure (~3.3 g/cm³) without excess sintering aids. This gives hot-pressed AlN superior flexural strength (440 MPa) and hardness (1070 Kgf/mm²) compared to tape-casting or CIP methods. Along with high thermal conductivity (140–170 W/m·K) and low thermal expansion matching Si/GaAs, HP-AlN withstands extreme abrasive thermal cycling, plasma etching, and molten metal erosion.
Can I buy large custom hot-pressed AlN ceramic components? What dimensions and parts are supplied by the manufacturer?
Yes, as a dedicated technical ceramic manufacturer, INNOVACERA produces extra-large hot-pressed AlN blocks and custom parts up to 500 × 500 × 350 mm (or Ø500 × 500 mm). We manufacture custom semiconductor heaters, plasma etching chamber components, microwave windows, and crystal growth crucibles. To get a competitive price quote and engineering review, please share your CAD drawings, required tolerances, and working environment specs.
