Aluminum Nitride Ceramic Thermal Pads Regular Size:
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For Package Type: TO-3P/TO-220/TO-247/TO-264/TO-3/TO-254/TO-257/TO-258, With Hole or Without Hole.
- TO-3P 25x20x1mm (other thickness is available, too);
- TO-220 20x14x1mm (other thickness is available, too);
- TO-247 22x17x0.635mm (other thickness is available, too);
- TO-264 28x22x1mm (other thickness is available, too);
- TO-3 39.7×26.67x1mm (Rhombus shape);
- TO-254 34x24x1mm (other thickness is available, too);
- TO-257 40x28x1mm (other thickness is available, too);
- TO-258 50.8×50.8x1mm (other thickness is available, too).
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Other Standard Size:
- 25.4×25.4mm;
- 114.3×114.3mm;
- 152x152mm;
- 190.5x138mm …
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Customized sizes are available.
Ceramic Thermal Pads Installation Steps:
- Clean the target surface: Clean the dust or stains on the surface of the object to be installed, and then align the hole position of the ceramic insulating sheet;
- Power tube bonding: Stick the power tube on the ceramic insulating sheet;
- Fixed the insulation sheet: Use screws to fix the power tube and ceramic insulating sheet on the installation object.
ALN Product Package Requirement:
- The product is cleaned according to the requirements, after completely dried, placed in the special pearl cotton packaging box.
- One group of 100 pieces of products is placed in the small cells in the packaging box. There are 5 cells in each packaging box, and 500 pieces can be placed in total.
- After each version of the packaging box is filled with products, it needs to wrap the film tightly, and attach the quantity label.
- Put the pearl-cotton packing box into the outer carton, paste the specification and quantity label on the surface.
- Package carton size: 21x21x12cm
- Gross weight: 1.5kgs
Applications:
- Power Devices
- MOS Transistor
- Heat Sink Interface
- MOSFET Transistor
- IGBT Transistor Heat Sink
- Chip ON Film (COF) Heat Conduction
- LED Board Thermal Interface Material (TIM)
- Integrated Circuit (IC) Chip Packaging Heat Conduction