Direct Plated Copper Substrate Key Attributes :
- Superior CTE and excellent thermal conductivity
- High reliability and durability
- Good Mechanically performance
- Low electrical resistance conductor traces
- Superior high-frequency characteristics
- Fine line resolution
- Low temperature process (below 300℃) guarantee the quality of ceramic and the metallized layer, also reduce the cost.
Direct Plated Copper Substrate Applications:
- High Power LED Packaging
- Hybrid and electric automobile power management electronics
- RF microwave communication
- Substrates for solar concentrator cells
- Power semiconductor packaging
- Laser system
- Fiber laser pump
DBC vs DPC
DBC being suited to high current capacity, however limited on circuit design. DPC allowing for finer tracks and through hole connection.
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Frequently Asked Questions
What is the difference between DPC and DBC ceramic substrates? Why is DPC preferred for high-density LED and RF packaging?
While Direct Bonded Copper (DBC) is suited for high-current applications with coarse layouts, Direct Plated Copper (DPC) utilizes magnetron sputtering, photolithography, and electroplating at low processing temperatures (<300°C). This allows for ultra-fine circuit line resolution, tight trace spacing, and reliable metallized through-hole vias with copper thicknesses from 10 μm to 130 μm. DPC provides matched CTE, superior high-frequency RF performance, and efficient thermal dissipation for high-power LEDs, laser pumps, and optical transceivers.
Can I order custom DPC ceramic substrates with through-hole vias? How to get a project price quote from the manufacturer?
Yes, as a precision technical ceramic manufacturer, INNOVACERA fabricates custom DPC ceramic substrates and PCBs using Al2O3 (Alumina) or AlN (Aluminum Nitride) bases. We support custom circuit layouts, filled/plated through-hole vias, selectable copper layers (10–130 μm), and protective surface finishes (ENIG, ENEPIG, or silver). To get a competitive price quotation, please submit your Gerber files, substrate material selection, panel dimensions, and layer requirements.
