With its compact footprint and optimized lead configuration, the Ceramic Quad No-Lead Package effectively reduces parasitic inductance and capacitance, making it ideal for high-frequency, high-speed, and high-integration semiconductor devices. Both dual-sided and quad-sided lead-out structures are available to meet different circuit design requirements.
Features
• Low parasitic parameters and small size
• Good heat dissipation and high reliability
• Two types of structures:dual-sided lead-out and quad-sided lead-out
• Multiple lead pitches,such as 1.27 mm,1.00 mm,0.50 mm,etc
Applications
• Suitable for high-density surface-mount packaging.
• Various VLSI(Very Large Scale Integration),ASIC(Application-
Specific Integrated Circuit),and ECL(Emitter Coupled Logic)circuits
Product Specifications
| Product Model | Number of Leads | Lead Pitch (mm) | Cavity Size (mm) | External Dimensions (mm) | Sealing Type |
| CLCC04E | 4 | 1 | 2.80×1.60 | 4.00×3.00 | Flat Sealing |
| CLCC04J | 4 | – | 8.25×7.90 | 20.00×10.26 | Flat Sealing |
| CLCC08F | 8 | 2.54 | 7.70×5.40 | 9.70×7.40 | Flat Sealing |
| CLCC16B | 16 | 2.54 | 3.60×5.40 | 20.00×7.74 | Flat Sealing |
| CLCC16BC | 16 | 2.54 | 3.60×5.40 | 20.00×7.74 | Flat Sealing |
| CLCC20 | 20 | 1.27 | 4.60×4.60 | 9.00×9.00 | Flat Sealing |
| CLCC24 | 24 | 1.27 | 4.70×4.70 | 8.54×8.54 | Flat Sealing |
| CQFN48B | 48 | 0.5 | 4.88×4.88 | 7.00×7.00 | Gold-Tin |
| CQFN48BC | 48 | 0.5 | 4.88×4.88 | 7.00×7.00 | Gold-Tin |
Material & Performance Advantages
The Ceramic Quad No-Lead Package is fabricated using high-purity alumina or advanced ceramic substrates, ensuring excellent mechanical strength, stable dielectric properties, and superior resistance to thermal shock. Compared with plastic packages, ceramic QFN packages offer lower moisture absorption, better hermeticity (for sealed types), and improved performance in harsh operating environments.
The optimized package design supports efficient heat transfer from the die to the PCB, making it suitable for high-power and high-frequency semiconductor devices.
Customization
Customized designs are available based on customer requirements, including:
Lead count and pitch customization
Cavity size and external dimensions
Sealing types such as flat sealing or gold-tin sealing
Metallization and surface finish options
Enquiry