technical ceramic solutions

Product Tags Ceramic surface-mount package

Ceramic Quad No-Lead Package

The Ceramic Quad No-Lead Package (CQFN / CLCC) from Innovacera is a high-performance ceramic semiconductor package designed for high-density surface-mount applications. Leveraging Innovacera’s extensive experience in advanced ceramic materials and precision manufacturing, this package delivers excellent electrical performance, superior thermal management, and long-term reliability for demanding electronic environments.

Ceramic Small Outline Package (CSOP)

The Ceramic Small Outline Package (CSOP) is a high-reliability ceramic IC packaging solution designed for miniaturized electronic systems that demand excellent mechanical strength, thermal stability, and electrical performance. Manufactured using advanced ceramic processing and precision metallization technology, CSOP packages provide superior protection and stable interconnection for integrated circuits operating in harsh and demanding environments.
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