Material Properties
| Property | Value | 92F | 93D | |
| Color | - | - | Black | White |
| Al2O3 Content | - | % | 92 | 93 |
| Density | 25℃ | g/cm3 | 3.7 | 3.65 |
| Thermal Conductivity | 25℃ | W/(m· K) | 20 | 18 |
| Coefficient of Linear Thermal Expansion | 40℃~400℃ | x10-6/℃ | 6.7 | 7 |
| 40℃~800℃ | 6.9 | 7.2 | ||
| Volume Resistance | 20℃ | Ω·cm | 1014 | 1014 |
| 300℃ | 1010 | 1010 | ||
| 500℃ | 108 | 109 | ||
| Dielectric Constant | 1MHZ | - | 10 | 9 |
| Dielectric Loss | 1MHZ | x10-4 | 4 | 4 |
| Flexural Strength | 0.5mm/min | MPa | 400 | 400 |
Ceramic packaging shells come in various structural forms depending on the characteristics and operating environments of different devices.
1. Ceramic Small Outline Package (CSOP)
Features:
- Compact size, wing-shaped leads, low stress
- Excellent resistance to mechanical shock
- Multiple lead pitches: 1.27mm, 1.00mm, 0.80mm, etc.
Applications:
- IC packaging
- High-reliability component packaging for space, radiation applications
2. Surface-Mount Device package (SMD)
Features
- High electrical conductivity and current-carrying capacity
- Large-area heat sink for the chip bonding zone
- Reliable performance and excellent thermal dissipation
Applications:
- Microwave device housing
- Crystal oscillator housing
3. Ceramic Dual in-line Package (CDIP)
Features
- Dual in-line package
- Wide range of pin counts
- EMI/RFI Protection
Applications:
- Programmable Logic Device, LSI
- Optocouplers, MEMS devices, etc.
4. Ceramic Leadless Chip Carrier/Ceramic Quad Flat Non-leaded Package (CLCC/CQFN)
Features
- Low parasitic parameters and compact size
- Excellent heat dissipation and high reliability
- Available in dual-sided and quad-sided lead configurations
- Multiple lead pitches: 1.27mm, 1.00mm, 0.50mm, etc.
Applications:
- Suitable for high-density surface mounting
- VLSI, ASIC, and ECL circuits
5. Laser SMD package
Features
- High thermal conductivity, superior crystal protection
- Stable performance and driving power
- Compact surface-mount device 7mm combined with built-in safety
- Enables ultra-long projection distances, narrow beam angles, and compact optical sizes
Applications:
- Portable Search and Rescue Lighting
- Automotive and Construction Lighting
- Outdoor and entertainment Lighting
6. ROSA/TOSA package
Features
- High airtightness and reliability
- Meets speed requirements from 10 GHz to 400 GHz in various applications
- Customizable development available
Applications:
- Fiber optic communications
- Optoelectronic transmitters and receivers
- Optical switches and modules, High-power lasers
Innovacera offers one-stop ceramic packaging solutions, ranging from standard parts to fully customized designs. For ceramic package housings, please feel free to contact us.
Declaration: This is an original article of INNOVACERA®. Please indicate the source link when reprinting: https://www.innovacera.com/product/ceramic-packages
Frequently Asked Questions
Need high-reliability IC protection? What types of custom ceramic packages are available?
Innovacera manufactures standard and custom ceramic packages across multiple configurations, including CSOP, SMD, CDIP, CLCC/CQFN, Laser SMD, and ROSA/TOSA housings. Formulated with black 92% Al₂O₃ (92F), white 93% Al₂O₃ (93D), and aluminum nitride (AlN), these hermetic enclosures offer high flexural strength (400 MPa), exceptional thermal dissipation, and radiation resistance for demanding telecom and IC packaging applications.
Looking for a certified packaging supplier? How do ceramic packages enhance optical and microwave devices?
As an advanced technical ceramic supplier, Innovacera provides hermetic ceramic packaging shells designed to dissipate heat and prevent environmental degradation in high-frequency environments. For microwave devices and high-speed fiber communications, our ceramic packages deliver low dielectric loss (4×10-4 at 1 MHz) and support transmission speeds from 10 GHz to 400 GHz in ROSA/TOSA optical modules and laser SMD assemblies.
