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Ceramic Packages

  • Ceramic Packages
  • Ceramic Dual in-line Package
  • Ceramic Small Outline Package
  • Surface-Mount Device package
  • Ceramic Packages

Ceramic packaging is the “case” that uses ceramic materials (like alumina, aluminum nitride, or beryllium oxide) as the housing or substrate for integrated circuits. It’s a protective enclosure or base that prevents the semiconductor chip from environmental damage and provides electrical connections to the outside world.

Ceramic Packages

Material Properties

Property Value 92F 93D
Color – – 黑色 白色
Al2O3 Content – % 92 93
Density 25℃ g/cm3 3.7 3.65
Thermal Conductivity 25℃ W/(m· K) 20 18
Coefficient of Linear Thermal Expansion 40℃~400℃ x10-6/℃ 6.7 7
40℃~800℃ 6.9 7.2
Volume Resistance 20℃ Ω·cm 1014 1014
300℃ 1010 1010
500℃ 108 109
Dielectric Constant 1MHZ – 10 9
Dielectric Loss 1MHZ x10-4 4 4
Flexural Strength 0.5mm/min MPa 400 400

Ceramic packaging shells come in various structural forms depending on the characteristics and operating environments of different devices.

 

1. Ceramic Small Outline Package (CSOP)

Features:

  • Compact size, wing-shaped leads, low stress
  • Excellent resistance to mechanical shock
  • Multiple lead pitches: 1.27mm, 1.00mm, 0.80mm, etc.

Applications:

  • IC packaging
  • High-reliability component packaging for space, radiation, or military/defense applications

 

2. Surface-Mount Device package (SMD)

Features

  • High electrical conductivity and current-carrying capacity
  • Large-area heat sink for the chip bonding zone
  • Reliable performance and excellent thermal dissipation

Applications:

  • Microwave device housing
  • Crystal oscillator housing

 

3. Ceramic Dual in-line Package (CDIP)

Features

  • Dual in-line package
  • Wide range of pin counts
  • EMI/RFI Protection

Applications:

  • Programmable Logic Device, LSI
  • Optocouplers, MEMS devices, etc.

 

4. Ceramic Leadless Chip Carrier/Ceramic Quad Flat Non-leaded Package (CLCC/CQFN)

Features

  • Low parasitic parameters and compact size
  • Excellent heat dissipation and high reliability
  • Available in dual-sided and quad-sided lead configurations
  • Multiple lead pitches: 1.27mm, 1.00mm, 0.50mm, etc.

Applications:

  • Suitable for high-density surface mounting
  • VLSI, ASIC, and ECL circuits

 

5. Laser SMD package

Features

  • High thermal conductivity, superior crystal protection
  • Stable performance and driving power
  • Compact surface-mount device 7mm combined with built-in safety
  • Enables ultra-long projection distances, narrow beam angles, and compact optical sizes

Applications:

  • Portable Search and Rescue Lighting
  • Automotive and Construction Lighting
  • Outdoor and entertainment Lighting

 

6. Laser SMD packa

Features

  • High airtightness and reliability
  • Meets speed requirements from 10 GHz to 400 GHz in various applications
  • Customizable development available

Applications:

  • Fiber optic communications
  • Optoelectronic transmitters and receivers
  • Optical switches and modules, High-power lasers

Innovacera offers one-stop ceramic packaging solutions, ranging from standard parts to fully customized designs. For ceramic package housings, please feel free to contact us.

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