technical ceramic solutions

Product Item

Ceramic Packages

Ceramic packaging is the “case” that uses ceramic materials (like alumina, aluminum nitride, or beryllium oxide) as the housing or substrate for integrated circuits. It’s a protective enclosure or base that prevents the semiconductor chip from environmental damage and provides electrical connections to the outside world.


Metallised Ceramic Rings for Image Intensifier Tubes(IIT)

Innovacera’s metallised ceramic rings are used in image intensifier tubes for night vision equipment and other instrument.


Alumina Ceramic Focus Rings

Alumina Ceramic Focus rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring – held in place by the electrostatic charge.


BMA Boron Nitride Atomization Nozzles

Innovacera’s BMA boron nitride composite nozzles deliver superior precision and reliability in molten metal atomization, so Innovacera BMA boron nitride nozzles is precision atomization for molten metals. Enhanced with zirconia for exceptional wear resistance and non-wetting properties, they withstand extreme temperatures in direct metal contact.


Petroleum pressure-bearing connector

Petroleum pressure-bearing connectors mainly rely on glass/ceramic-metal sealing technology to achieve high telecommunication transmission and pressure-bearing performance under high temperature and high humidity conditions. They are widely used in deep well oil exploration. Featured products include single-core sealed connectors and multi-core sealed connectors.


Micro Rectangular Connector

The rectangular sealed connector seals the metal shell and the contact piece through high-performance glass materials. This series of connectors realizes the circuit connection between the cables of electrical and electronic equipment, the cables and equipment instruments, and the printed boards, and realizes the transmission of low-frequency signals, high-frequency signals and current.


Hermetic Optoelectronic Packaging Solutions

Optoelectronic packages serve as the critical interface for photonic components. We deliver end-to-end precision packaging solutions from design to mass production. Leveraging advanced materials and automated processes, our products ensure superior optical signal integrity and long-term reliability, meeting stringent demands in 5G communications, LiDAR systems, medical imaging, and beyond.


TO-220 Ceramic Insulator Cooling Pads

Innovacera TO-220 Ceramic Insulators were to be mounted between the TO-220 packaged power transistors and the heatsink, its dimensions is 14 x 20 x 1 mm (0.55 x 0.79 x 0.04in), the Mounting hole diameter can be 3.8mm or 5mm, without holes and customized holes is also available. It was packed by 100pcs per bag, TO-220 Ceramic Insulator Cooling Pads is widely used for semiconductor devices, high power equipment, integrated circuit, ICMOS tube, IGBT patch insulation, triode, high frequency power supply communication, mechanical equipment, high current, high voltage, high temperature, insulation parts requiring heat conduction.


TO 247 Ceramic Insulating Sheet

Innovacera TO-247 Ceramic Insulating Sheet is designed to optimize thermal management in discrete semiconductors, including MOSFETs, IGBTs, and transistors. TO-247 Ceramic Insulating Sheet is a high-performance thermal interface product and was made by Alumina Ceramic (Al₂O₃) and Aluminum Nitride Ceramics material and they have two types which including the cooling pad with 3.7mm holes and without holes.


Silicon Nitride Grinding Media Balls

Innovacera Silicon Nitride Grinding Media Balls was made by 3 forming way: titration, roll and CIP (cold isostatic pressing ) forming and they were gas pressing sinetering in 1800~2100℃.The purity of silion nitride is 99% and generally if the diameter size is more than 3mm, we will choose the CIP forming way.


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