Product Item | INNOVACERA

Zirconia (ZTA) Substrates

Innovacera’s Zirconia Toughened Alumina (ZTA) Substrates combine the superior strength of zirconia with the stability of alumina, offering excellent mechanical performance, high reflectivity, and outstanding resistance to thermal shock. With a dense white appearance and exceptional surface finish, these substrates ensure reliable operation in medium-power electronic and optical applications. Their robust toughness and precise machining capability make them an ideal choice for medium-power supply modules, LED lighting systems, and precision instruments.

Silicon Nitride (Si₃N₄) Substrates

Innovacera’s Silicon Nitride (Si₃N₄) Substrates combine exceptional thermal conductivity, high mechanical strength, and excellent fracture toughness, providing outstanding reliability for high-power electronic and thermal management applications. With a thermal expansion coefficient closely matched to silicon and superior resistance to thermal shock, these substrates maintain stable performance under extreme conditions. Their precision-engineered surfaces and customizable specifications make them ideal for IGBT power modules, high-power heat sinks, and advanced wireless modules.

Aluminum nitride (AlN) Substrates

Innovacera’s Aluminum Nitride (AlN) Substrates deliver exceptional thermal conductivity, a thermal expansion coefficient closely matched to silicon, and excellent electrical insulation, making them an ideal choice for high-power electronic applications. With superior mechanical strength, high breakdown voltage, and outstanding thermal shock resistance, AlN substrates ensure reliable performance in demanding environments. Their precision machining capability and customizable specifications make them well-suited for IGBT power modules, high-power LEDs, and advanced heat dissipation components.

96 Alumina (Al2O3) Substrates

Innovacera’s 96 Alumina (Al₂O₃) Substrates combine high density, superior thermal conductivity, and excellent dielectric strength, making them an ideal choice for electronic and energy applications. With outstanding resistance to high temperature, acid, and alkali corrosion, these substrates ensure stable performance even in demanding environments. Their precision machining and customizable sizes provide reliable solutions for thick and thin film resistors, low-power LEDs, and energy storage systems.

Ceramic Packages

Ceramic packaging is the “case” that uses ceramic materials (like alumina, aluminum nitride, or beryllium oxide) as the housing or substrate for integrated circuits. It’s a protective enclosure or base that prevents the semiconductor chip from environmental damage and provides electrical connections to the outside world.

Metallised Ceramic Rings for Image Intensifier Tubes(IIT)

Innovacera’s metallised ceramic rings are used in image intensifier tubes for night vision equipment and other instrument.

Alumina Ceramic Focus Rings

Alumina Ceramic Focus rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring – held in place by the electrostatic charge.

BMA Boron Nitride Atomization Nozzles

Innovacera’s BMA boron nitride composite nozzles deliver superior precision and reliability in molten metal atomization, so Innovacera BMA boron nitride nozzles is precision atomization for molten metals. Enhanced with zirconia for exceptional wear resistance and non-wetting properties, they withstand extreme temperatures in direct metal contact.

Petroleum pressure-bearing connector

Petroleum pressure-bearing connectors mainly rely on glass/ceramic-metal sealing technology to achieve high telecommunication transmission and pressure-bearing performance under high temperature and high humidity conditions. They are widely used in deep well oil exploration. Featured products include single-core sealed connectors and multi-core sealed connectors.

Micro Rectangular Connector

The rectangular sealed connector seals the metal shell and the contact piece through high-performance glass materials. This series of connectors realizes the circuit connection between the cables of electrical and electronic equipment, the cables and equipment instruments, and the printed boards, and realizes the transmission of low-frequency signals, high-frequency signals and current.