The Ceramic Dual In-line Package (DIP) Enclosure is a high-reliability ceramic housing designed for integrated circuits and electronic components requiring stable electrical performance, thermal management, and hermetic sealing. Manufactured from advanced technical ceramics, this enclosure offers excellent insulation properties, mechanical strength, and long-term reliability under demanding operating conditions.
The Ceramic Small Outline Package (CSOP) is a high-reliability ceramic IC packaging solution designed for miniaturized electronic systems that demand excellent mechanical strength, thermal stability, and electrical performance. Manufactured using advanced ceramic processing and precision metallization technology, CSOP packages provide superior protection and stable interconnection for integrated circuits operating in harsh and demanding environments.
Silicon nitride coil supports are widely used as sensors in underground mining, geological exploration and other fields.
Innovatech offers a series of high-voltage ceramic feedthroughs for 5, 10, and 20 kVDC, and up to 120 kV.
Gas atomization powdering is to smelt the metal alloy and flow it out through a nozzle (leak). At the nozzle outlet, the liquid metal is atomized by high-speed airflow, and then rapidly condensed to obtain formed powder.
Innovacera’s quadrupole mass filter, abbreviated as quadrupole, is the core component of the quadrupole mass spectrometer. It is usually composed of four parallel cylindrical or hyperbolic metal rods. Two pairs of electrodes are applied: DC voltage (DC, U) and radio frequency voltage (RF, V·cos(ωt)). The quadrupole mass analyzer separates ions based on the stability of the ion trajectory in the oscillating electric field.
Innovacera’s Ceramic Fuse Holders are engineered for exceptional thermal stability, electrical insulation, and mechanical strength, making them essential components in modern EV fuse systems. Manufactured from high-purity alumina ceramics, these holders provide reliable protection against overcurrent and short-circuit conditions, ensuring the safety and efficiency of power and energy storage systems. With excellent heat resistance, corrosion resistance, and high dielectric performance, they offer long-term durability and consistent performance in demanding new energy and electrical applications.
Innovacera’s Zirconia Toughened Alumina (ZTA) Substrates combine the superior strength of zirconia with the stability of alumina, offering excellent mechanical performance, high reflectivity, and outstanding resistance to thermal shock. With a dense white appearance and exceptional surface finish, these substrates ensure reliable operation in medium-power electronic and optical applications. Their robust toughness and precise machining capability make them an ideal choice for medium-power supply modules, LED lighting systems, and precision instruments.
Innovacera’s Silicon Nitride (Si₃N₄) Substrates combine exceptional thermal conductivity, high mechanical strength, and excellent fracture toughness, providing outstanding reliability for high-power electronic and thermal management applications. With a thermal expansion coefficient closely matched to silicon and superior resistance to thermal shock, these substrates maintain stable performance under extreme conditions. Their precision-engineered surfaces and customizable specifications make them ideal for IGBT power modules, high-power heat sinks, and advanced wireless modules.
Innovacera’s Aluminum Nitride (AlN) Substrates deliver exceptional thermal conductivity, a thermal expansion coefficient closely matched to silicon, and excellent electrical insulation, making them an ideal choice for high-power electronic applications. With superior mechanical strength, high breakdown voltage, and outstanding thermal shock resistance, AlN substrates ensure reliable performance in demanding environments. Their precision machining capability and customizable specifications make them well-suited for IGBT power modules, high-power LEDs, and advanced heat dissipation components.
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