CDIP Packages for Integrated Circuits
Innovacera provides a comprehensive of ceramic packaging, including nine types such as CDIP, CFP, and CQFP. These ceramic packages are widely used in integrated circuits and optical communications to semiconductors, laser packaging, and optoelectronic devices. Main packages focus on small to medium form factors with 8 to 44 pins, providing optimal versatility for most design requirements.
Alumina ceramic is good choice material of cost-sensitive applications, aluminum nitride is for high-power and thermally critical designs. Ceramic Dual In-line Package (CDIP) can be broad range of lead counts to accommodate diverse circuit layouts.
Ceramic Package Types
– Ceramic Dual In-line Package (CDIP)
– Ceramic Flat Package (CFP)
– Ceramic Quad Flat No-leads (CQFN)
– Ceramic Pin Grid Array (CPGA)
– Ceramic Small Outline Package (CSOP)
– Ceramic Leadless Chip Carrier (CLCC)
– Ceramic Quad Flat Package (CQFP)
– Surface Mount Device (SMD)
– ROSA Ceramic Package
– TOSA Ceramic Package
Material Properties: 92% vs. 93% Alumina
| Property | Test Conditions | Unit | 92% Alumina (Black) | 93% Alumina (White) |
| Al₂O₃ Content | – | % | 92 | 93 |
| Density | 25°C | g/cm³ | 3.7 | 3.65 |
| Thermal Conductivity | 25°C | W/(m·K) | 20 | 18 |
| Coeff. of Thermal Expansion | 40–400°C | ×10⁻⁶/°C | 6.7 | 7.0 |
| 40–800°C | ×10⁻⁶/°C | 6.9 | 7.2 | |
| Volume Resistivity | 20°C | Ω·cm | 10¹⁴ | 10¹⁴ |
| 300°C | Ω·cm | 10¹⁰ | 10¹⁰ | |
| 500°C | Ω·cm | 10⁸ | 10⁹ | |
| Dielectric Constant | 1 MHz | – | 10 | 9 |
| Dielectric Loss | 1 MHz | ×10⁻⁴ | 4 | 4 |
| Flexural Strength | 0.5 mm/min | MPa | 400 | 400 |
With growing electric vehicles, semiconductor tech, and high-frequency communications, the global ceramic packaging market is on the rise too. There are a few key innovations driving this growth: high-thermal-conductivity substrates (aluminum nitride, or AlN, and alumina, Al₂O₃), multilayer ceramic packages (MLC/MLP), and advanced hermetic sealing.
Aluminum nitride substrates stand out with thermal conductivity ranging from 170 to 200 W/, plus great CTE (coefficient of thermal expansion) matching. These features boost the reliability and performance of power modules. On the other hand, multilayer ceramic packages cut down on RF signal loss and let you achieve higher integration density—making them a perfect fit for 5G/6G front-end modules, all kinds of ICs, and MEMS sensors.
Hermetic packaging ensures long-term operational stability. That’s a must-have for semiconductor manufacturing, test equipment, and tough optoelectronic applications where consistent performance matters.
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