technical ceramic solutions

Product Tags Ceramic IC package

Ceramic Dual In-line Package (DIP) Enclosure

The Ceramic Dual In-line Package (DIP) Enclosure is a high-reliability ceramic housing designed for integrated circuits and electronic components requiring stable electrical performance, thermal management, and hermetic sealing. Manufactured from advanced technical ceramics, this enclosure offers excellent insulation properties, mechanical strength, and long-term reliability under demanding operating conditions.

Ceramic Small Outline Package (CSOP)

The Ceramic Small Outline Package (CSOP) is a high-reliability ceramic IC packaging solution designed for miniaturized electronic systems that demand excellent mechanical strength, thermal stability, and electrical performance. Manufactured using advanced ceramic processing and precision metallization technology, CSOP packages provide superior protection and stable interconnection for integrated circuits operating in harsh and demanding environments.
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