Features
• High thermal conductivity
• Thermal expansion coefficient close to silicon wafer
• High breakdown voltage
Application
• High power IGBT power module
• High-power LED
• High power heat sink
Material Properties Table
Project | Test conditions | Unit | AlN | |||
AN-170 | AN-200 | AN-230 | ||||
Material | – | – | AlN | AlN | AlN | |
Appearance | – | – | Light blue | beige | beige | |
Surface roughness | Ra | μm | 0.2~0.75 | 0.2~0.75 | 0.2~0.75 | |
Density | – | g/cm 3 | ≥3.3 | |||
Physical properties | Bending strength | 3 -point bending resistance | MPa | ≥400 | ≥350 | ≥300 |
Vickers hardness | Load 4.9 | GPa | ≥10 | |||
Water absorption | – | % | – | |||
Thermal performance | Thermal conductivity | 25℃ | W/(m·k) | ≥170 | ≥200 | ≥230 |
Linear thermal expansion coefficient | 25-500℃ | x10 -6 mm/℃ | 4~6 | |||
Thermal shock resistance | 800℃ | Time | ≥10 | |||
Specific heat | – | J/(kg·K) | 720 | |||
Electrical properties | Dielectric constant | 1MHz/25℃ | – | 8~9 | ||
Dielectric loss | 1MHz/25℃ | x10 -4 | ≤3 | |||
Volume resistivity | 25℃ | Ω·cm | > 10 14 | |||
Breakdown voltage | – | kV/mm | > 17 | |||
Light performance | Reflectivity | Reflectivity meter | – | – | ||
Whiteness | Whiteness meter | – | – |
Specifications and Dimensions
Size(mm)
Thickness ( mm ) |
0.25 | 0.38 | 0.5 | 0.635 | 0.76 | 1.0 | 1.2 | 1.5 | 2.0 |
101.6*101.6 | √ | √ | √ | √ | √ | √ | √ | √ | √ |
114.3*114.3 | √ | √ | √ | √ | √ | √ | √ | √ | √ |
120*120 | √ | √ | √ | √ | √ | √ | √ | √ | √ |
138*190 | √ | √ | √ | √ | √ | √ | √ |
Processing
• Laser processing
• Grinding and polishing sheet roughness table
Project | Qualified | Special Grade | ||
Internal dimension tolerance | ±0.05mm | ±0.03mm | ||
External dimension tolerance | ±0.15mm | ±0.1mm | ||
Hole tolerance (φ0.07-0.15mm) | ±0.05mm | ±0.02mm | ||
Hole tolerance (φ > 0.15mm) | ±0.1mm | ±0.02mm | ||
Project | Surface roughness (μm ) | |||
Qualified | Special Grade | |||
Grinding | 0.3-0.6 | 0.3-0.5 | ||
Fine grinding | 0.1-0.4 | 0.1-0.3 | ||
Polishing | ≤0.1 | ≤0.05 |