technical ceramic solutions

Project Tags AlN Substrates

Aluminum Nitride Substrates for Thermal Management

Aluminum Nitride (AlN) is a premier material for thermal management in high-power electronics due to its exceptional thermal conductivity and high electrical resistivity. AlN substrates are essential for components like high-power LEDs, laser diodes, and power modules, where efficient heat dissipation is critical for performance and reliability. Innovacera manufactures high-purity, hot-pressed Aluminum Nitride substrates and thermal pads, offering superior solutions for the most demanding thermal challenges in modern electronics.

Semiconductor Ceramic Substrates

Innovacera provides advanced semiconductor ceramic substrates critical for high-power and high-frequency electronics, including Direct Bonded Copper (DBC) substrates offering robust copper-ceramic bonding for superior thermal management and power cycling, Direct Plated Copper (DPC) substrates enabling ultra-fine circuit patterns and high-precision interconnections through laser drilling and copper plating, and Aluminum Nitride (AlN) wafer substrates renowned for their exceptional thermal conductivity and low expansion coefficient, ideal for demanding semiconductor applications requiring efficient heat dissipation.
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