technical ceramic solutions

Project Tags electronic packaging

Ceramic Substrates

Innovacera provides a comprehensive range of high-performance ceramic substrates, including 96% Alumina (Al2O3), Aluminum Nitride (AlN), Silicon Nitride (Si3N4), and Zirconia Toughened Alumina (ZTA). Designed for demanding electronic applications, these substrates offer superior thermal conductivity, electrical insulation, and mechanical strength. Innovacera employs advanced manufacturing processes to ensure exceptional flatness, precise dimensional control, and superior surface finish, guaranteeing reliable performance in high-power semiconductors, optoelectronics, and critical thermal management systems.

Metallization of Ceramics for Electronic Packaging

Ceramic metallization is the process of applying a thin, adherent metal layer onto a ceramic surface, enabling it to be brazed to other components. This is fundamental for electronic packaging, creating hermetic seals for sensors, RF packages, and power modules that require both electrical conductivity and insulation. Innovacera offers various metallization services, including Mo-Mn and thick-film techniques, to create reliable, high-performance ceramic-to-metal assemblies for the electronics industry.
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