Innovacera's Silicon Nitride (Si₃N₄) Substrates combine exceptional thermal conductivity, high mechanical strength, and excellent fracture toughness, providing outstanding reliability for high-power electronic and thermal management applications. With a thermal expansion coefficient closely matched to silicon and superior resistance to thermal shock, these substrates maintain stable performance under extreme conditions. Their precision-engineered surfaces and customizable specifications make them ideal for IGBT power modules, high-power heat sinks, and advanced wireless modules.