Large Size Aluminum Nitride Ceramic Substrate 190×138mm

INNOVACERA’s 190×138 mm aluminum nitride ceramic substrate provides a large effective processing area for power electronics, semiconductor packaging, and ceramic circuit manufacturing.

Aluminum nitride ceramic combines high thermal conductivity with excellent electrical insulation, helping transfer heat away from electronic components while maintaining reliable electrical isolation.

Its low thermal expansion coefficient supports stable performance in electronic packaging and helps reduce thermal stress during repeated heating and cooling cycles.

The large-format AlN substrate is available in 0.38 mm and 0.635 mm thicknesses and is suitable for DPC, AMB, metallization, and other ceramic circuit processing applications.

Click Here for more information:https://www.innovacera.com/news/laser-cutting-and-singulation-techniques-for-aln-ceramic-substrates-in-advanced-semiconductor-packaging.html

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