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TO-3P Ceramic Heat Sink

  • TO-3P Ceramic Heat Sink
  • TO-3P Ceramic Heat Sink
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  • Ceramic Heat Sink

TO-3P Ceramic heat sinks and thermal pads are designed to provide superior thermal performance in advanced thermal management solution such as high power applications, particularly for insulated-gate bipolar transistor (IGBT) modules.These heat sinks have advantages of heat dissipation, electrical insulation and mechanical stability which extended service life of power electronics in hard environments.

TO-3P Ceramic Heat Sink

Innovacera Develops a series of TO-220 TO-247 TO-3P TO-264 ceramic heat sink for IGBT Power Modules. Main ceramic material of TO-3P ceramic heat sink is Alumina Ceramic (Al₂O₃) and Aluminum Nitride (AlN) which is high thermal conductivity ceramics. TO-3P AlN heat sink is electrical insulation substrate.

Applications
TO-3P ceramic heat sinks are widely used in:
·IGBT thermal management and power module cooling
·High-temperature power electronics and IGBT junction cooling
·Industrial motor drives and UPS systems
·Solar inverters and wind turbine converters
·Electric vehicle (EV) traction inverters and onboard chargers
·High-frequency welding equipment and induction heating systems

By reducing hotspot formation and improving thermal uniformity, they enhance IGBT switching efficiency by up to 15% and extend module lifespans by 2–3X compared to conventional solutions.

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