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Ceramic substrate: The core base material of high-performance ceramic PCB Company
Currently, electronic products are evolving rapidly towards high power, high integration, and high reliability. The limitations of traditional organic substrates in terms of heat dissipation bottlenecks, high-temperature tolerance and long-term stabi…
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How To Solve The Problem Of Insufficient Heat Dissipation Of Ceramic Substrate In Thermoelectric Cooler Company
Thermoelectric cooling is a new technology that has the potential to revolutionize the way things are kept cold, whether it is food, wine, beer or cigars. In fact, it is a completely different approach to refrigeration from standard compressors. …

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