AMB Substrate

AMB (Active Metal Brazing) is a method of sealing ceramics and metals developed on the basis of DBC technology.   Compared with traditional DBC substrates, ceramic substrates prepared by AMB process not only have higher thermal conductivit…

When perform brazing (for example, Ag) in the H2 environment and it requires extreme heat and energy cycle resistance, with unique high and low temperature impact resistance, AMB substrates become an ideal packaging material for new generation semico…