Aluminum Nitride Ceramic Thermal Pads

Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices.
The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact.
The pads are made by ceramic material such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance.

Quote/Order

Aluminum Nitride Ceramic Thermal Pads Regular Size:

For Package Type: TO-3P/TO-220/TO-247/TO-264/TO-3/TO-254/TO-257/TO-258, With Hole or Without Hole.
TO-3P 25x20x1mm (other thickness is available, too);
TO-220 20x14x1mm (other thickness is available, too);
TO-247 22x17x0.635mm (other thickness is available, too);
TO-264 28x22x1mm (other thickness is available, too);
TO-3 39.7x26.67x1mm (Rhombus shape);
TO-254 34x24x1mm (other thickness is available, too);
TO-257 40x28x1mm (other thickness is available, too);
TO-258 50.8x50.8x1mm (other thickness is available, too).
Other Standard Size:
25.4x25.4mm;
114.3x114.3mm;
152x152mm;
190.5x138mm …
Customized sizes are available.

Ceramic Thermal Pads Installation Steps:

Clean the target surface: Clean the dust or stains on the surface of the object to be installed, and then align the hole position of the ceramic insulating sheet;
Power tube bonding: Stick the power tube on the ceramic insulating sheet;
Fixed the insulation sheet: Use screws to fix the power tube and ceramic insulating sheet on the installation object.

AlN Product Package Requirement:

The product is cleaned according to the requirements, after completely dried, placed in the special pearl cotton packaging box.
One group of 100 pieces of products is placed in the small cells in the packaging box. There are 5 cells in each packaging box, and 500 pieces can be placed in total.
After each version of the packaging box is filled with products, it needs to wrap the film tightly, and attach the quantity label.
Put the pearl-cotton packing box into the outer carton, paste the specification and quantity label on the surface.
Package carton size: 21x21x12cm
Gross weight: 1.5kgs

Applications:

Power Devices
MOS Transistor
Heat Sink Interface
MOSFET Transistor
IGBT Transistor Heat Sink
Chip ON Film (COF) Heat Conduction
LED Board Thermal Interface Material (TIM)
Integrated Circuit (IC) Chip Packaging Heat Conduction

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Declaration: This is an original article of INNOVACERA®. Please indicate the source link when reprinting: https://www.innovacera.com/product/aluminum-nitride-ceramic-thermal-pads

Frequently Asked Questions

Why choose aluminum nitride (AlN) ceramic thermal pads over silicone pads? How do they improve power module cooling?

Aluminum nitride (AlN) ceramic thermal pads deliver exceptional thermal conductivity (140–180 W/m·K)—over 50 to 100 times higher than traditional silicone or mica thermal pads—combined with excellent dielectric breakdown strength (>15 kV/mm). When placed between heat sinks and high-power components (like TO-220, TO-247, MOSFETs, and IGBTs), AlN pads eliminate hot spots, bridge air gap thermal resistance, and prevent high-temperature aging or electrical shorting under extreme voltages.

Can I buy standard TO-package AlN thermal pads or order custom sizes? What options are provided by the supplier?

Yes, as a specialized technical ceramic supplier, INNOVACERA provides standard AlN thermal pads for TO-3P, TO-220, TO-247, TO-264, and TO-3 packages (with or without mounting screw holes), as well as custom-machined plates up to 190.5 × 138 mm. Shipped in protective 500-piece moisture-proof pearl-cotton packaging, they are available in bulk with fast lead times. Contact us with your dimensions and package types to receive factory-direct pricing.