INNOVACERA Silicon Nitride substrates, with a thermal conductivity rating of 90 Watts/meter Kelvin, at first glance, appear inferior to Aluminum Nitride grades from the standpoint of heat dissipation. However, Silicon Nitride substrates, due to their far superior mechanical properties, can provide thermal resistance levels comparable to Aluminum Nitride.
This is because Silicon Nitride substrates have twice the strength and fracture toughness of Aluminum Nitride substrates, which enable the circuit/package designer to use Silicon Nitride substrates that can be half as thick as Aluminum Nitride substrates.
These same impressive mechanical properties also make Silicon Nitride substrates an excellent choice in applications where severe, repetitive thermal cycling of the circuit/package is present.
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