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Ceramic Core for Chip Inductor (3)
Ceramic Core for Chip Inductor (2)
Ceramic Core for Chip Inductor (1)
Ceramic Core for Chip Inductor (1)

Ceramic Core for Chip Inductor

The ceramic core is a precision component used inside wirewound RF chip inductors to support coil winding and create a stable inductive structure. Its geometry, groove, termination areas, and dimensional consistency influence winding position, coil stability, terminal connection, and automated assembly.

Quote/Order

INNOVACERA manufactures these cores using precision ceramic forming and controlled metallization. They provide electrical insulation, mechanical support, and consistent dimensions for precision winding, terminal connection, lead free soldering, or high-temperature bonding. Multiple structures, termination styles, and standard chip sizes are available for miniature, high-frequency RF chip inductors.

Product Features

- Designed for wirewound RF chip inductors and surface-mount winding and assembly
- High dimensional accuracy and batch consistency support stable winding and terminal connection
- Flat and L-shaped terminations are available for different electrode and assembly designs
- Tin-plated terminals support lead-free soldering; gold-plated terminals support high-temperature bonding
- Custom sizes, core structures, terminations, and metallization systems are available

Available Specifications

Item Available Options
Ceramic Material 96% Alumina Ceramic
Standard Size Codes 0603, 0804, 1005, 1608, 2012, 2520, 3216
Core Structures 2U / 2H / 4H
Termination Configurations Flat Termination / L-Shaped Termination
Metallization System Mo-Mn or Ag / Pd base layer, with optional Ni intermediate layer
Surface Finish Standard Tin Plating / Optional Gold Plating

Typical Material Properties

Property Unit A-96 White Alumina
Alumina Content % 96
Bulk Density g/cm³ 3.7
Flexural Strength MPa 320
Dielectric Constant 9.5
Dissipation Factor ×10⁻³ <10

Typical Applications

Used in wirewound ceramic RF chip inductors and other surface-mount high-frequency wirewound inductors for MHz-to-GHz circuits, wireless communication, communication equipment, automotive electronics, industrial electronics, and consumer electronics.

Looking for the right ceramic core for your RF chip inductor project?

Send us your drawing or target dimensions and specify the required core structure, termination, metallization, and surface finish. INNOVACERA supports sample evaluation, technical review, and custom production.

Declaration: This is an original article of INNOVACERA®. Please indicate the source link when reprinting: https://www.innovacera.com/product/ceramic-core-for-chip-inductor

Frequently Asked Questions

Looking for a Custom Chip Inductor Ceramic Core Manufacturer? What Sizes and Structures Are Available?

As a precision ceramic manufacturer, INNOVACERA provides custom 96% alumina ceramic cores specifically designed for wirewound RF chip inductors. We offer standard chip size codes ranging from 0603, 0804, 1005, 1608, 2012, 2520, to 3216, with structural options including 2U, 2H, and 4H configurations. We fully support custom dimensions, specialized groove designs, and tight tolerances based on customer technical drawings for high-frequency MHz-to-GHz circuit applications.

What Metallization and Termination Options Does the Supplier Offer? How Do They Support Assembly?

To match diverse automated assembly and electrode requirements, the supplier provides both Flat and L-shaped terminations. Metallization systems include Mo-Mn or Ag/Pd base layers with an optional Ni intermediate barrier. For assembly, tin-plated terminations are available for standard lead-free soldering, while gold-plated terminations support high-temperature bonding, ensuring high terminal connection reliability and dimensional stability.

How to get a quote?

We will support your project with the required technical and developmental support

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Our engineers respond within 1-3 business day.

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