technical ceramic solutions

Do you know the difference between HTCC and LTCC?

In the early 1980s, the multilayer substrate of the circuit board of the commercialized main computer was co-fired at a high temperature of 1600°C with alumina insulating materials and conductor materials (Mo, W, Mo-Mn), that is, high-temperature co-fired. Fired ceramic (HTCC). With the development of high-frequency and high-speed communication, in order to achieve low loss, high speed, and high-density packaging, low-temperature co-fired ceramics (LTCC) came into being.

The process flow of low-temperature co-fired ceramics (LTCC) and high-temperature co-fired ceramics (HTCC) is similar, including tape casting, drilling, filling, lamination, slicing, co-firing, inspection, and other steps. But do you know the difference between them?

The following table is a simple introduction to the difference between LTCC and HTCC, let us see it.

The main difference between HTCC and LTCC
Name Ceramic Material Metallic Material Co-firing Temperature Advantage Weakness Product/

Application

HTCC

(High Temperature co-fired Ceramic)

(1)Alumina

(2)Alumina Nitride

(3)Mullite and etc.

Tungsten, Molybdenum, Manganese, Molybdenum-Manganese, etc. 1650°C- 1850°C (1)Higher mechanical strength

(2)High heat dissipation coefficient

(3)Lower material cost

(4)Stable chemical properties

(1)Low conductivity

(2)High production cost

Product:

(1)heating body

(2)Multilayer Ceramic Substrate

(3)Ceramic shell, etc.

 

LTCC

(Low-Temperature Co-fired Ceramic)

(1)Glass-ceramic materials

(2)Glass + Ceramic Composite Materials

(3)Amorphous glass-based materials

Silver, Gold, Copper, Palladium Silver, etc. Below 95°C (1) High conductivity

(2) Low production cost

(3) It has a small thermal expansion coefficient and dielectric constant, and the dielectric constant is easy to adjust

(4) Excellent high-frequency performance

(5) Due to the low sintering temperature, some components can be sealed inside

(1) Low mechanical strength

(2) Low heat dissipation coefficient

(3) High material cost

Application:

Manufacturing of integrated circuit packaging, multi-chip mold (MCM), micro-electro-mechanical systems (MEMS), inductors, capacitors, transformers, and antennas.

 

Hope the above information is helpful for you. And the important note: INNOVACERA’s ceramic heater is belonging HTCC.

Ceramic heater-Do you know the difference between HTCC and LTCC

Do you know the difference between HTCC and LTCC

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