technical ceramic solutions

Do you know the difference between HTCC and LTCC?

In the early 1980s, the multilayer substrate of the circuit board of the commercialized main computer was co-fired at a high temperature of 1600°C with alumina insulating materials and conductor materials (Mo, W, Mo-Mn), that is, high-temperature co-fired. Fired ceramic (HTCC). With the development of high-frequency and high-speed communication, in order to achieve low loss, high speed, and high-density packaging, low-temperature co-fired ceramics (LTCC) came into being.

The process flow of low-temperature co-fired ceramics (LTCC) and high-temperature co-fired ceramics (HTCC) is similar, including tape casting, drilling, filling, lamination, slicing, co-firing, inspection, and other steps. But do you know the difference between them?

The following table is a simple introduction to the difference between LTCC and HTCC, let us see it.

The main difference between HTCC and LTCC
Name Ceramic Material Metallic Material Co-firing Temperature Advantage Weakness Product/



(High Temperature co-fired Ceramic)


(2)Alumina Nitride

(3)Mullite and etc.

Tungsten, Molybdenum, Manganese, Molybdenum-Manganese, etc. 1650°C- 1850°C (1)Higher mechanical strength

(2)High heat dissipation coefficient

(3)Lower material cost

(4)Stable chemical properties

(1)Low conductivity

(2)High production cost


(1)heating body

(2)Multilayer Ceramic Substrate

(3)Ceramic shell, etc.



(Low-Temperature Co-fired Ceramic)

(1)Glass-ceramic materials

(2)Glass + Ceramic Composite Materials

(3)Amorphous glass-based materials

Silver, Gold, Copper, Palladium Silver, etc. Below 95°C (1) High conductivity

(2) Low production cost

(3) It has a small thermal expansion coefficient and dielectric constant, and the dielectric constant is easy to adjust

(4) Excellent high-frequency performance

(5) Due to the low sintering temperature, some components can be sealed inside

(1) Low mechanical strength

(2) Low heat dissipation coefficient

(3) High material cost


Manufacturing of integrated circuit packaging, multi-chip mold (MCM), micro-electro-mechanical systems (MEMS), inductors, capacitors, transformers, and antennas.


Hope the above information is helpful for you. And the important note: INNOVACERA’s ceramic heater is belonging HTCC.

Ceramic heater-Do you know the difference between HTCC and LTCC

Do you know the difference between HTCC and LTCC