AlN substrate surface finish can be selected according to the downstream process. INNOVACERA provides grinding, fine lapping, polishing and precision polishing, together with custom thicknesses, dimensions and machining features for different application requirements.
Product Specification
| Specification | Capability |
|---|---|
| Material | Aluminum nitride (AlN) |
| Thermal conductivity | 170 / 200 / 230 W/m·K |
| Thickness | 0.38 / 0.55 / 0.635 mm standard, others on request |
| Thickness tolerance | ±0.05 mm typical |
| Common sizes | 50.8 × 50.8, 100 × 100, 114.3 × 114.3, 120 × 120 mm, customized size is available. |
| Largest master size | 138 × 190 mm |
| Outer dimensions | ±0.15 mm, down to ±0.10 mm on review |
| Holes and slots | ±0.05 mm, down to ±0.03 mm on review |
| Warpage | under 0.3% on specified production configurations |
| Surface finish | grinding, fine lapping, polishing, precision polishing |
| Best roughness | Ra ≤ 0.05 μm |
| Machining | cutting, holes, slots, discs, custom profiles |
Flatness, Warpage and TTV
Flatness and TTV are specified according to substrate size, thickness and measurement method. For precision applications, requirements can be evaluated against the customer drawing and defined inspection area. Warpage below 0.3% is available on specified production configurations.
Finish Roughness
Grinding is Ra 0.3–0.6 μm. Fine lapping, 0.1–0.4. Polishing gets under 0.10, precision polishing to 0.05 and below. A substrate that only has to move heat is fine at grinding. An LD submount or a thin-film circuit grinding is not enough, because the next step, whether deposition, litho or die attach, cares about more than the surface. AlN substrates for thin-film processing, DPC and precision metallization generally require a lapped or polished surface before subsequent customer processing.
Inspection
Inspection can include dimensions, thickness, roughness, warpage, flatness and edge quality. Density, thermal conductivity and other material properties can be verified according to project requirements. Inspection reports are available for production programs when required.
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Frequently Asked Questions
Why Is Mirror Polishing (Ra <= 0.05 µm) Essential for Thin-Film AlN Substrates? How Does It Prevent Metallization Voiding?
In thin-film circuits, photolithography, and laser diode die bonding, microscopic surface asperities or micro-pits cause uneven photoresist exposure, sputtering pinholes, and solder voiding. INNOVACERA’s lapped and polished aluminum nitride (AlN) substrates undergo multi-stage surface lapping and polishing down to Ra <= 0.05 µm with warpage held under 0.3%. This mirror-flat finish guarantees ultra-fine line resolution for DPC, void-free eutectic soldering, and maximum thermal boundary contact under concentrated 170–230 W/m·K heat flux.
Need Precision Micro-Holes or Pre-Diced Laser Submounts? How to Order Custom Polished AlN Plates from INNOVACERA?
Photonics packaging and RF modules frequently demand specialized board outlines, micro-via holes, and tight TTV tolerances. INNOVACERA provides full custom secondary processing for polished AlN substrates, supporting laser profiling, precision hole/slot machining down to ±0.03 mm, and double-sided polishing up to 138 x 190 mm master panel sizes. Simply submit your required thermal conductivity grade (170, 200, or 230 W/m·K), thickness (0.38 to 0.635 mm), and CAD drawings for technical verification and rapid prototyping.
