Direct Plated Copper DPC Substrates

Direct Plated Copper DPC Substrates fuse high thermal conductivity ceramics with precise copper circuitry. Innovacera utilizes magnetron sputtering to deposit pure copper onto Al?O? or AlN, achieving exceptional bond strength, fine line resolution, and superior heat dissipation. Outperforming standard PCB and thick-film substrates in thermal management, our DPC technology is critical for high-power VCSELs, automotive LEDs, and concentrated photovoltaics, ensuring reliable performance in miniaturized electronic packages.