thermal management | Project Tags

Direct Bonded Copper Ceramic Substrates

Direct bonded copper (DBC) ceramic substrates create robust thermal and electrical interconnection platforms by bonding oxygen-free copper layers (0.1-0.6mm thick) to ceramic substrates like alumina or aluminum nitride through high-temperature oxidation processes. These substrates handle extreme current loads (300A+) and power densities exceeding 500W/cm² in IGBT modules, MOSFET arrays, and thyristor packages. Innovacera's DBC process achieves exceptional bond strength (>20 N/cm² peel strength) and thermal cycling reliability, making them ideal for automotive traction inverters, industrial motor drives, and renewable energy systems. The copper layers can be pre-patterned or chemically etched to create complex circuit geometries with minimal undercut and excellent edge definition. With thermal conductivity up to 200 W/mK (for AlN DBC) and dielectric strength >15 kV/mm, our DBC substrates outperform conventional PCB materials in high-voltage, high-frequency applications. Innovacera provides complete DBC solutions including design support, prototyping, and volume production for power electronic assemblies requiring superior thermal management and electrical performance.

High Performance Ceramic Substrates

Innovacera's High Performance Ceramic Substrates provide superior thermal management, electrical insulation, and mechanical stability. Made from Al2O3, AlN, Si3N4, or ZTA, they withstand -55°C to 850°C thermal cycling while maintaining dimensional and electrical integrity. Ideal for power modules, LEDs, RF/microwave circuits, and semiconductors, with precise flatness, smooth surface, and customizable metallization for automotive, aerospace, telecom, and industrial applications.

Ceramic Heat Sinks for Power Electronics Cooling

Ceramic heat sinks are an advanced solution for thermal management in power electronics, offering both high thermal conductivity and excellent electrical insulation. Materials like Aluminum Nitride (AlN) and Alumina (Al2O3) dissipate heat effectively while isolating components, making them ideal for LEDs, IGBT modules, and MOSFETs. Innovacera manufactures custom ceramic heat sinks that provide superior, reliable cooling performance, replacing traditional metal sinks where electrical insulation is critical.

Direct Bonded Copper (DBC) and Direct Plated Copper (DPC) Substrates

Direct Bonded Copper (DBC) and Direct Plated Copper (DPC) substrates are key technologies in power electronics. They involve bonding a pure copper layer to a ceramic base, typically Alumina or Aluminum Nitride, providing excellent thermal dissipation and electrical insulation. These substrates are crucial for IGBT modules, power LEDs, and automotive electronics. Innovacera offers high-quality DBC and DPC substrates, enabling superior performance and reliability in high-power applications.

Aluminum Nitride Substrates for Thermal Management

Aluminum Nitride (AlN) is a premier material for thermal management in high-power electronics due to its exceptional thermal conductivity and high electrical resistivity. AlN substrates are essential for components like high-power LEDs, laser diodes, and power modules, where efficient heat dissipation is critical for performance and reliability. Innovacera manufactures high-purity, hot-pressed Aluminum Nitride substrates and thermal pads, offering superior solutions for the most demanding thermal challenges in modern electronics.