Projects | INNOVACERA

Ceramic Thermal Management Solutions for Power Electronics

Innovacera delivers high-performance Ceramic Thermal Management Solutions for the power electronics industry. Our heat sinks, crafted from Aluminum Nitride (AlN) and Alumina (Al2O3), provide the perfect balance of high thermal conductivity and superior electrical isolation. By leveraging Ceramic Injection Molding (CIM), we provide custom-engineered cooling solutions for IGBTs, RF amplifiers, and LED systems, ensuring maximum heat dissipation and system reliability without the risk of electrical short circuits.

Aluminum Nitride Ceramic Substrates for Power Modules

Innovacera’s aluminum nitride (AlN) ceramic substrates provide exceptional thermal conductivity (170-200 W/mK) for efficient heat dissipation in power modules. With a coefficient of thermal expansion closely matching silicon, they reduce thermal stress in IGBT and MOSFET assemblies. Available in various thicknesses and metallization options (DBC, DPC, thick film), these substrates enable high current densities and compact designs. Innovacera ensures high purity and precise dimensional tolerances for automotive and industrial power electronics.

Pyrolytic Boron Nitride Crucibles for MBE Systems

Innovacera manufactures high-purity Pyrolytic Boron Nitride (PBN) crucibles specifically designed for Molecular Beam Epitaxy (MBE) systems. These crucibles exhibit exceptional thermal stability, anisotropic thermal conductivity, and chemical inertness, ensuring minimal contamination during epitaxial growth of III-V and II-VI semiconductors. The near-net shape fabrication provides consistent wall thickness and smooth surfaces, crucial for uniform flux distribution. Innovacera’s PBN crucibles are the preferred choice for research and production MBE chambers.

Metallized Ceramics for Vacuum Sealing Applications

Innovacera’s metallized ceramics provide hermetic and reliable sealing solutions for vacuum environments. By applying a refractory metal coating (such as Mo-Mn) to high-purity alumina or other ceramic substrates, these components enable strong ceramic-to-metal brazing. They exhibit excellent thermal shock resistance and electrical insulation, making them ideal for vacuum feedthroughs, connectors, and semiconductor processing equipment. With precision metallization techniques, Innovacera ensures leak-tight seals that withstand extreme temperatures and pressures, outperforming traditional glass-to-metal seals in durability and performance.

Aluminum Nitride Ceramic Substrates for Power Electronics

Aluminum Nitride (AlN) ceramic substrates combine high thermal conductivity with excellent electrical insulation, making them ideal for power electronics and IGBT modules. Compared to alumina, AlN dissipates heat more efficiently while maintaining low dielectric loss. Innovacera’s advanced hot-pressing and metallization technologies ensure reliable AlN substrates for high-power, high-frequency electronic applications.

Pyrolytic Boron Nitride Components for MBE Systems

Pyrolytic Boron Nitride (PBN) components are essential in MBE systems due to their ultra-high purity, anisotropic thermal conductivity, and resistance to chemical attack. Compared to graphite, PBN ensures cleaner crystal growth. Innovacera supplies precision PBN crucibles, plates, and rings for advanced epitaxial growth applications.

Alumina Ceramic Components for Semiconductor Equipment

Alumina Ceramic (Al?O?) components are widely used in semiconductor equipment due to their high dielectric strength, excellent wear resistance, and chemical stability in plasma and vacuum environments. Compared with metals, alumina ceramics offer lower particle generation and superior corrosion resistance. Innovacera leverages precision forming and high-temperature sintering to deliver consistent, high-purity alumina parts for etching, deposition, and wafer handling tools.

Ceramic-to-Metal Assemblies for Industrial Connectors

Ceramic-to-metal assemblies combine the insulation of ceramics with the strength of metals, enabling reliable industrial connectors and feedthroughs. Active brazing and metallization ensure strong, hermetic joints. Innovacera provides customized ceramic-to-metal assemblies for vacuum, power, and high-reliability industrial connector applications.

Ceramic Substrates

Innovacera provides a comprehensive range of high-performance ceramic substrates, including 96% Alumina (Al2O3), Aluminum Nitride (AlN), Silicon Nitride (Si3N4), and Zirconia Toughened Alumina (ZTA). Designed for demanding electronic applications, these substrates offer superior thermal conductivity, electrical insulation, and mechanical strength. Innovacera employs advanced manufacturing processes to ensure exceptional flatness, precise dimensional control, and superior surface finish, guaranteeing reliable performance in high-power semiconductors, optoelectronics, and critical thermal management systems.

Ceramic Housings for 5G Telecommunications

The deployment of 5G networks demands components with low dielectric loss and high thermal stability. Innovacera’s Ceramic Housings, including TOSA/ROSA and specialized RF packages, meet these stringent requirements. Our precision-machined ceramic enclosures protect critical optical and microwave components in base stations, ensuring signal integrity and longevity in outdoor environments.