Aluminum Nitride Substrates for Thermal Management

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Aluminum Nitride Ceramics|With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride (AlN) Ceramics is ideal for applications where heat dissipation is required. In addition, since it off…
Hot-Pressed Aluminum Nitride|Some extreme environments require the high electrical resistivity in additional to exceptional thermal conductivity, high abrasive and high-temperature thermal cycling. To solve this kind problem, Inn…
Aluminum Nitride Ceramic Thermal Pads|Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices.The pads are …
Aluminum Nitride Wafer Substrates|Innovacera standard aluminum nitride wafer diameters are from 50.8 mm (2 inch) to 200 mm (8 inch) ; mostly use are 6” aluminum nitride wafers and 8” AlN wafer substrates . AlN Wafers can be produced i…
Direct Plated Copper Substrate|Direct Plated Copper (DPC) is a newest development in the field of Ceramic Substrate PCBs, its process is by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of t…
Direct Bonded Copper Substrates|DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a …

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