Aluminum nitride products are attracting more and more attention as a new generation of high thermal conductivity materials due to their superior thermal conductivity, high insulation, and thermal expansion rate close to silicon.

Features:

1. High thermal conductivity: about 7 times the thermal conductivity of alumina
2. Thermal expansion rate: thermal expansion is close to silicon, and the reliability of the mounting of large silicon wafers and heat-resistant cycles
3. Electrical characteristics: high insulation, low dielectric coefficient
4. Mechanical properties: superior to the mechanical properties of alumina
5. Corrosion resistance: stronger than molten metal corrosion resistance
6. Purity: low impurity content, non-toxic, high purity

Application:

• High-power transistor module substrate
• High-frequency device substrate
• Heat-radiating insulation board for turn module
• Fixed substrate for semiconductor laser and light-emitting diode
• Hybrid integrated module, the ignition device module
• IC package
• Thermal module substrate
• Some products for semiconductor production equipment