DPC

The Through Ceramic Via (TCV) interconnection technology is an innovative approach for high-density three-dimensional packaging. Traditional ceramic substrate metallization schemes often encounter challenges such as residual liquid inside the holes,…

VCSEL (Vertical Cavity Surface Emitting Laser) laser diodes have become increasingly popular in the telecommunications, sensing, LIDAR, and optical interconnect industries due to their high efficiency, low power consumption, and high-speed modulation…

The metallized ceramic substrate is a kind of circuit board. It has a thermal expansion coefficient close to that of semiconductors and high heat resistance. It is suitable for products with high heat generation (high-brightness LED, solar energy…

DPC (Direct Plated Copper) Metallized Ceramic Substrate Smaller, Thinner Thin Film, Thick Film Design. Better Heat Dissipation; Longer Lifetime DPC Substrate Why DPC Metallized Substrate? DPC is created for better electrical performance and…