The Through Ceramic Via (TCV) interconnection technology is an innovative approach for high-density three-dimensional packaging. Traditional ceramic substrate metallization schemes often encounter ch…
INNOVACERA
DPC
VCSEL (Vertical Cavity Surface Emitting Laser) laser diodes have become increasingly popular in the telecommunications, sensing, LIDAR, and optical interconnect industries due to their high efficiency…
The metallized ceramic substrate is a kind of circuit board. It has a thermal expansion coefficient close to that of semiconductors and high heat resistance. It is suitable for products with high heat…
DPC (Direct Plated Copper) Metallized Ceramic SubstrateSmaller, Thinner Thin Film, Thick Film Design.Better Heat Dissipation; Longer Lifetime DPC SubstrateWhy DPC Metallized Substrate?DPC is created f…