Metallized Ceramic

Metallization ceramic cylinders are a crucial component of vacuum interrupters (often referred to as VI) used in the fabrication of vacuum circuit breakers (VCB). VCBs find application in medium-voltage switchgear and distribution circuits, where the…

As demand for high-performance electronics continues to grow, the need for reliable and efficient thermal management solutions has never been greater. That's why we're excited to introduce our new line of Ceramic Metalized Thin Film Pads, the perfect…

In a development that could have a significant impact on the electronics industry, the latest ceramic metallized insulators are making strides in enhancing semiconductor packaging and related applications. These insulators offer a range of practical …

Ceramic-to-Metal brazing components are widely used in electrical engineering due to their good performance for high-vacuum, high-voltage and high-pressure applications. We manufacture a large range of metalized ceramic components with the latest tec…

ENIG (Electroless Nickel Immersion Gold) is a surface plating that is applied over the copper pads on a Printed Circuit Board to protect them from corrosion and other abnormalities. Initially, the copper pad is covered by a Nickel (Ni) layer followed…

While we often associate electroplating with metal products, the process also works with some non-metallic materials, such as ceramics. Manufacturers often choose to electroplate a coating of metal onto a ceramic substrate for the same reasons as…

Innovacera supplies custom refractory metallized alumina ceramics for use in power grid tubes, x-ray tubes, vacuum interrupters, and similar applications where ceramic-to-metal seal joints of exceptional strength and hermeticity are required. …

To keep pace with rapidly changing technology, customers need durable and reliable packaging materials. INNOVACER Advanced Materials produces high performance ceramic lids to meet your microelectronic packaging application whether for the semicon…

Technical Ceramic Components are integral to semiconductor manufacturing equipment, technical ceramic components are high in purity with low levels of trace metals, this means they can constitute either the process chamber material or interior proces…

DPC (Direct Plated Copper) Metallized Ceramic Substrate Smaller, Thinner Thin Film, Thick Film Design. Better Heat Dissipation; Longer Lifetime DPC Substrate Why DPC Metallized Substrate? DPC is created for better electrical performance and…