The 2026 edition of electronica, the International Exhibition for Electronic Components, officially opened in Munich, Germany, on November 10 and runs through November 13. Xiamen Innovacera Advanced Materials Co., Ltd. is showcasing its advanced ceramic products at the event in Hall A6, Stand 359.
At this exhibition, INNOVACERA will showcase products including ceramic substrates, metallized ceramics, ceramic-to-metal brazed assemblies, and ceramic packages for optical communications, demonstrating the company’s product offerings and manufacturing capabilities in advanced ceramic materials, precision machining, and ceramic-to-metal joining.
Main Products to Be Exhibited
Ceramic Substrates
Ceramic substrates are one of the key products on display. INNOVACERA supplies alumina, AlN and silicon nitride ceramic substrates. AlN stands out for its high thermal conductivity and good insulation performance, and is commonly adopted in power electronics, semiconductor packaging and laser applications.
Currently available aluminum nitride substrates include thermal conductivity grades of 170, 200, and 230 W/(m·K), and can be machined according to application requirements, including grinding, polishing, laser cutting, and drilling.
Metallized Ceramics
Metallized ceramic products include metallized ceramic rings, ceramic tubes, and other custom structural components. By forming a metal layer on the ceramic surface, these parts can meet the process requirements for subsequent welding, brazing, and electrical connections.
INNOVACERA can provide ceramic parts in different sizes, structures, and metallization specifications based on product drawings and operating conditions, suitable for electronic packaging, vacuum devices, and electrical insulation components.
Ceramic-to-Metal Brazed Assemblies
Ceramic-to-metal brazing is another manufacturing capability offered by INNOVACERA. Through brazing processes, alumina ceramics can be joined to metal materials such as stainless steel and Kovar alloy to produce assemblies with insulation, sealing, or structural connection functions.
Related products include ceramic-to-metal hermetic seals, vacuum feedthroughs, and other custom connection components, which can be designed and machined according to customer-provided drawings.
Ceramic Packages for Optical Communications
With the development of high-speed optical communication technology, optical device packaging has placed higher demands on the dimensional accuracy, material performance, and structural design of components.
INNOVACERA provides ceramic packages and related packaging components for optical communications. Based on the structural design of different devices, suitable ceramic materials can be selected, and custom machining can be carried out in accordance with metallization and subsequent assembly requirements. The related products are intended for optical communication device packaging applications.
Visit INNOVACERA at electronica 2026
electronica is a major exhibition in the global electronics industry, bringing together companies and professionals in electronic components, electronic systems, and related technology fields. The 2026 edition will be held concurrently with SEMICON Europa in Munich.
At the show, the INNOVACERA team is showcasing its ceramic components and talking with visitors about their projects, including material options, product applications, and custom part requirements.
The exhibition is now underway. Visit us at Hall A6, Stand 359, to learn more about INNOVACERA’s advanced ceramic products and speak with our team in person.
electronica 2026 Exhibition Information
| Item | Details |
|---|---|
| Exhibition | electronica 2026 |
| Date | November 10–13, 2026 |
| Venue | Messe München, Munich, Germany |
| INNOVACERA Booth | Hall A6, Stand 359 |
We look forward to seeing you in Munich!
