INNOVACERA will exhibit at electronica 2026, November 10–13, at Messe München in Munich, Germany. Visit us at Hall A6, Booth 359 to explore advanced ceramic solutions for thermal management, electrical insulation and hermetic packaging.
We help customers solve application challenges through ceramic material selection, component customization, precision machining, metallization and ceramic-to-metal joining. By reviewing drawings and operating requirements, we work with customers to develop ceramic components and assemblies suited to their designs.

This year’s display will highlight aluminum nitride (AlN) substrates, alongside ceramic packages, ceramic-to-metal brazed assemblies, ceramic heaters and large-size ceramic fuse tubes—demonstrating how our materials and processing capabilities support different electronic and photonic applications.
AlN Substrates with Thermal Conductivity up to 230 W/m·K
For high-power electronics and photonics, effective thermal management must be combined with reliable electrical insulation.
INNOVACERA offers AlN substrates with thermal conductivity from 170 to 230 W/m·K, depending on the material grade.
Key substrate sizes available in the 230 W/m·K grade include:
| Length × Width (mm) | Thickness (mm) |
|---|---|
| 100 × 100 | 0.635 |
| 100 × 100 | 0.55 |
| 100 × 100 | 0.38 |
| 114.3 × 114.3 | 0.33 |
| 50.8 × 50.8 | 0.712 |

Precision polishing can achieve surface roughness below 0.05 μm. Custom shapes, holes and slots are also available to meet component design and assembly requirements.
Our broader AlN substrate range includes standard 190 × 138 mm sheets and insulating substrates for TO packages. Available thermal conductivity grades and surface finishes can be discussed for the required size and thickness.

For customers developing power modules, LED assemblies and optical communication components, we can review substrate dimensions, flatness, surface finish and machining requirements to help identify a suitable ceramic solution.
Ceramic Packages and Hermetic Assemblies
INNOVACERA will showcase HTCC packages including SMD ceramic package bodies, metallized ceramics and ceramic-to-metal brazed assemblies for electronic and optoelectronic applications.
Our capabilities span HTCC, metallization and ceramic-to-metal brazing, supporting projects that require electrical insulation and hermetic ceramic-to-metal interfaces. The display will include ceramic package bodies and assembled components, allowing visitors to discuss both individual parts and joining requirements.
By reviewing package geometry, metallization areas, mating metal materials and leak-testing requirements, we help customers develop ceramic and joining solutions suited to their assemblies.

Ceramic Heaters and Large-Size Ceramic Fuse Tubes
Our ceramic heater display will feature components for rapid heating and compact installation. Visitors can discuss heater geometry, supply voltage, power, target temperature and mounting requirements with our team.
We will also present large-size ceramic fuse tubes, including a size of 158.8 × 158.8 × 133.7 mm. These ceramic bodies provide electrical insulation and structural support within fuse assemblies and can be evaluated against customer drawings and assembly requirements.

Selected precision ceramic components will further demonstrate our ability to produce complex shapes and machined features for application-specific designs.
Discuss Your Application at Hall A6, Booth 359
Every application brings its own thermal, electrical and mechanical requirements. INNOVACERA works with customers to translate these requirements into practical ceramic component and assembly solutions, with support from material selection and manufacturability review through sample development.
Whether you need a substrate for heat dissipation, a ceramic-to-metal assembly for hermetic sealing or a customized heater, bring your drawings or share your application requirements with our team. We can discuss suitable materials, processing options and next steps for your project.
To arrange a meeting before the exhibition, contact your INNOVACERA representative or visit our website.
Visit INNOVACERA at electronica 2026
Exhibition: electronica 2026
Dates: November 10–13, 2026
Venue: Messe München, Munich, Germany
Location: Hall A6, Booth 359
Website: www.innovacera.com
We look forward to meeting you in Munich.