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INNOVACERA at electronica 2026: Advanced Ceramic Solutions for Electronics | Hall A6, Booth 359

INNOVACERA will exhibit at electronica 2026, November 10–13, at Messe München in Munich, Germany. Visit us at Hall A6, Booth 359 to explore advanced ceramic solutions for thermal management, electrical insulation and hermetic packaging.

 

We help customers solve application challenges through ceramic material selection, component customization, precision machining, metallization and ceramic-to-metal joining. By reviewing drawings and operating requirements, we work with customers to develop ceramic components and assemblies suited to their designs.

 

INNOVACERA electronica 2026

 

This year’s display will highlight aluminum nitride (AlN) substrates, alongside ceramic packages, ceramic-to-metal brazed assemblies, ceramic heaters and large-size ceramic fuse tubes—demonstrating how our materials and processing capabilities support different electronic and photonic applications.

 

AlN Substrates with Thermal Conductivity up to 230 W/m·K

 

For high-power electronics and photonics, effective thermal management must be combined with reliable electrical insulation.
INNOVACERA offers AlN substrates with thermal conductivity from 170 to 230 W/m·K, depending on the material grade.

 

Key substrate sizes available in the 230 W/m·K grade include:

Length × Width (mm) Thickness (mm)
100 × 100 0.635
100 × 100 0.55
100 × 100 0.38
114.3 × 114.3 0.33
50.8 × 50.8 0.712

 

AlN substrates

 

Precision polishing can achieve surface roughness below 0.05 μm. Custom shapes, holes and slots are also available to meet component design and assembly requirements.

 

Our broader AlN substrate range includes standard 190 × 138 mm sheets and insulating substrates for TO packages. Available thermal conductivity grades and surface finishes can be discussed for the required size and thickness.

 

Aluminium Nitride AlN substrates

 

For customers developing power modules, LED assemblies and optical communication components, we can review substrate dimensions, flatness, surface finish and machining requirements to help identify a suitable ceramic solution.

 

Ceramic Packages and Hermetic Assemblies

 

INNOVACERA will showcase HTCC packages including SMD ceramic package bodies, metallized ceramics and ceramic-to-metal brazed assemblies for electronic and optoelectronic applications.

 

Our capabilities span HTCC, metallization and ceramic-to-metal brazing, supporting projects that require electrical insulation and hermetic ceramic-to-metal interfaces. The display will include ceramic package bodies and assembled components, allowing visitors to discuss both individual parts and joining requirements.

 

By reviewing package geometry, metallization areas, mating metal materials and leak-testing requirements, we help customers develop ceramic and joining solutions suited to their assemblies.

 

主图advanced ceramic solutions

 

Ceramic Heaters and Large-Size Ceramic Fuse Tubes

 

Our ceramic heater display will feature components for rapid heating and compact installation. Visitors can discuss heater geometry, supply voltage, power, target temperature and mounting requirements with our team.

 

We will also present large-size ceramic fuse tubes, including a size of 158.8 × 158.8 × 133.7 mm. These ceramic bodies provide electrical insulation and structural support within fuse assemblies and can be evaluated against customer drawings and assembly requirements.

 

Alumina and AlN ceramic heater

 

Selected precision ceramic components will further demonstrate our ability to produce complex shapes and machined features for application-specific designs.

 

Discuss Your Application at Hall A6, Booth 359

 

Every application brings its own thermal, electrical and mechanical requirements. INNOVACERA works with customers to translate these requirements into practical ceramic component and assembly solutions, with support from material selection and manufacturability review through sample development.

 

Whether you need a substrate for heat dissipation, a ceramic-to-metal assembly for hermetic sealing or a customized heater, bring your drawings or share your application requirements with our team. We can discuss suitable materials, processing options and next steps for your project.

 

To arrange a meeting before the exhibition, contact your INNOVACERA representative or visit our website.

 

Visit INNOVACERA at electronica 2026

 

Exhibition: electronica 2026
Dates: November 10–13, 2026
Venue: Messe München, Munich, Germany
Location: Hall A6, Booth 359
Website: www.innovacera.com

 

We look forward to meeting you in Munich.

Frequently Asked Questions

Where can you meet INNOVACERA at electronica 2026? What ceramic solutions will be on display?

You can visit INNOVACERA at Hall A6, Booth 359 at Messe München, Germany, from November 10–13, 2026. INNOVACERA will display a comprehensive range of advanced ceramic solutions for electronic and photonic applications, including aluminum nitride (AlN) substrates, HTCC packages, ceramic-to-metal brazed assemblies, ceramic heaters, and large-size ceramic fuse tubes (such as 158.8 × 158.8 × 133.7 mm).

What are the key specifications of INNOVACERA’s AlN substrates? How do they support high-power electronics?

INNOVACERA provides AlN substrates offering thermal conductivity from 170 up to 230 W/m·K combined with excellent electrical insulation. Available in thicknesses from 0.33 mm to 0.712 mm (with sizes like 100 × 100 mm and 114.3 × 114.3 mm) and achievable surface roughness below 0.05 μm, these substrates deliver critical thermal dissipation for power modules, LED assemblies, and optical communication devices.

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