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HTCC Ceramic Packaging Technology: The Key to High Power and High Frequency Applications Company
In the modern electronics industry, the three types of ceramic packaging and component technologies, namely HTCC, LTCC and MLCC, jointly form the foundation of high-performance electronic systems. Although they all belong to the multi-la…
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Why choose zirconia ceramics as a thermal insulation plate? Company
Zirconia (ZrO₂) ceramics are widely used as thermal insulation plates thanks to their excellent thermal insulation performance, high mechanical strength, and outstanding stability at elevated temperatures. The excellent insulation performance of zirc…
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Pain Points in Thick- and Thin-Film Circuit Fabrication and Ceramic Substrate Advantages Company
In the pursuit of high performance and high reliability in electronic manufacturing, traditional substrate materials have become increasingly unable to meet the ever more demanding requirements. Limited thermal conductivity, poor high-temperature sta…
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In the electric drive system (motor driver/Inverter) of new energy vehicles, the IGBT power module or power semiconductor module is the core component. They are responsible for converting the direct current (DC) from the battery into alternating curr…
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In industrial thermal energy applications and household gas appliances, the ignition system is a core starting component whose performance directly determines the equipment’s starting efficiency, safety, and service life. Thanks to their superior hig…
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