-
AMB for new generation semiconductor Company
When perform brazing (for example, Ag) in the H2 environment and it requires extreme heat and energy cycle resistance, with unique high and low temperature impact resistance, AMB substrates become an ideal packaging material for new generation semico…
-
Aluminum Nitride (AlN) Ceramic Crucible Company
Due to its high thermal conductivity (≥170W/m.k), aluminum nitride ceramic crucibles can be used for heat conduction to achieve heating effects, and are widely used in electronic equipment, such as gas atomization of electronic devices. [caption i…
-
Alumina Ceramic Parts as Photolithography Machines in the Semiconductor Industry Company
Alumina Ceramic parts are used for rotating parts in photolithography machines and in a vacuum state. This requires extremely high machining accuracy, and the runout of the inner circle is required to be within 2 microns. Fine ceramics have become…
-
ALN Heater Substrate For Semiconductor-Manufacturing Company
High thermal conductivity makes Aluminum Nitride an excellent choice where fast response or high levels of uniform temperatures are required. A clean, non-contaminating heat source, AlN’s high thermal conductivity prevents cracking. Aluminum Nitri…
-
What Makes BeO Outstanding for Electronic Packaging Company
In electronic packaging for RF and microwave, people are always looking for a very good insulation material with excellent properties that can be withstand the extreme strict environmental conditions in Military and aerospace applications. [captio…