technical ceramic solutions

Ceramic Package For Sensors

ceramic package

Ceramic is commonly used in packages due to its superior mechanical properties, suitable for small, high density, and surface mountable applications- including accelerometers and angular rate, pressure, optical and RF sensors.


  • Air-cavity type hermetic package
  • Close thermal-expansion Matching provides superior mechanical elasticity and less mechanical stress with silicon MEMS chips
  • Miniaturized, high-density surface mountable package incorporating multi-layer ceramic technology.

Ceramic Package For Sensors


  • Accelerometers
  • Angular rate sensors (Avro sensors. vaw-rate sensors)
  • Pressure sensors
  • CMOS/ CCD Image sensors

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