INNOVACERA

technical ceramic solutions

Ceramic Package For Sensors

ceramic package

Ceramic is commonly used in packages due to its superior mechanical properties, suitable for small, high density, and surface mountable applications- including accelerometers and angular rate, pressure, optical and RF sensors.

Features:

  • Air-cavity type hermetic package
  • Close thermal-expansion Matching provides superior mechanical elasticity and less mechanical stress with silicon MEMS chips
  • Miniaturized, high-density surface mountable package incorporating multi-layer ceramic technology.

Ceramic Package For Sensors

Applications:

  • Accelerometers
  • Angular rate sensors (Avro sensors. vaw-rate sensors)
  • Pressure sensors
  • CMOS/ CCD Image sensors

If you have any inquiry, pls feel free to contact us.

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