Ceramic is commonly used in packages due to its superior mechanical properties, suitable for small, high density, and surface mountable applications- including accelerometers and angular rate, pressure, optical and RF sensors.
- Air-cavity type hermetic package
- Close thermal-expansion Matching provides superior mechanical elasticity and less mechanical stress with silicon MEMS chips
- Miniaturized, high-density surface mountable package incorporating multi-layer ceramic technology.
- Angular rate sensors (Avro sensors. vaw-rate sensors)
- Pressure sensors
- CMOS/ CCD Image sensors
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