Ceramic is commonly used in packages due to its superior mechanical properties, suitable for small, high density, and surface mountable applications- including accelerometers and angular rate, pressure, optical and RF sensors.

Features:

• Air-cavity type hermetic package
• Close thermal-expansion Matching provides superior mechanical elasticity and less mechanical stress with silicon MEMS chips
• Miniaturized, high-density surface mountable package incorporating multi-layer ceramic technology.

Applications:

• Accelerometers
• Angular rate sensors (Avro sensors. vaw-rate sensors)
• Pressure sensors
• CMOS/ CCD Image sensors

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