Direct Bonding Copper

Direct Bond Copper/DBC Ceramic Substrate For Electronics Company

DBC Ceramic Substrate Specifications: Material: 96% Alumina + Cu/Ag Coating. Max Size: 138*188mm Thickness: 0.25-1.0mm (0.25, 0.38, 0.5, 0.63, 0.76, 1.0mm). General Size: 2"*2"(50.8*50.8mm) 3"*3"(76.2*76.2mm) 4"*4"(101.6*101.…