In semiconductor manufacturing, boron nitride can be used as an etching agent and thin film deposition raw material, acting as a protective layer to prevent damage or contamination of the device.
In addition, boron nitride can also be used as an electron beam evaporation source material for the preparation of various thin film materials.
For example: Electron beam evaporation coating conductive boron nitride crucible (BN crucible) – for thin film deposition equipment.
Conductive boron nitride crucibles are high-purity smooth crucibles designed for electron beam evaporation coatings.
It has excellent high-temperature resistance and thermal cycling properties, and will not react with various metals and ceramic rare earths.
Even under rapid heating and cooling conditions, the crucible remains intact.
It can be used for alloy melting, rare earth and ceramic sintering, and electron beam evaporation coatings.
It is commonly used in thermal evaporation processes such as high-frequency induction heating, coatings, electron beam evaporation coatings, aluminum, and silicon plating.
Conductive boron nitride crucibles offer high purity, high finish, and excellent electron beam evaporation coating properties.
They increase evaporation rates, accelerate material changeovers, improve thermal stability, and reduce power requirements, ultimately increasing productivity and cost-effectiveness.
Advantages:
good film finish, high purity, less pollution, long service life.
1.Excellent resistance to high temperatures and heat cycling.
It has a low rate of thermal expansion and is resistant to wetting of most molten metals.
2.Heat-resistant up to 2000°C, boron nitride does not react with aluminum and is not volatile.
3.increase evaporation rate; Increasing the evaporation rate results in shorter cycle times and higher overall yields.
4.Rapid material change; Conductive boron nitride crucibles facilitate rapid material changes, minimize furnace chamber downtime, and improve process efficiency.
5.enhanced thermal stability; These crucibles have higher thermal stability, reducing heat transfer from the crucible itself, ensuring consistent and controllable evaporation.
Main ingredients: BN+TiB2
Density 3.0g/cm3
Binding composition: B2O3
Color: Grey
Room temperature resistivity: 300-2000 Ω·cm
Operating temperature: below 1800℃
Thermal conductivity: > 40W/mk
Coefficient of thermal expansion: (4-6) x10-6K
Bending strength: > 130Mpa
Evaporation rate: 0.35-0.5g/min·cm2
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