technical ceramic solutions

Electrical Insulation Alumina Ceramic Parts For Implanter Semiconductor Process Equipment

Alumina ceramic parts are widely used in semiconductor process equipment due to their excellent electrical insulation properties, high thermal conductivity, and mechanical strength. In semiconductor manufacturing, alumina ceramic parts are particularly important in implanter equipment.

 

Alumina Ceramic Base

 

Implanter Equipment uses in ion implantation, a critical process in semiconductor fabrication where ions are accelerated and implanted into a substrate to modify its properties.

 

Alumina Ceramic Parts in implanter using including insulators, wafers, and support structures, all designed to withstand high temperatures and corrosive environments typical of ion implantation processes:

 

  • Ceramic Wafer Carriers: Hold and support wafers during ion implantation.
  • Ceramic Insulator Rings: Prevent electrical leakage and ensure safety.
  • All kinds of Feedthroughs: Provide pathways for electrical signals while maintaining vacuum integrity.

Alumina Ceramic Base

 

Alumina Ceramic Parts Advantages:

  • High Electrical Insulation
  • Preventing electrical leakage and ensuring safety in semiconductor processes
  • Good Thermal Conductivity
  • Preventing overheating of semiconductor components
  • Excellent Mechanical Strength
  • Resistant to wear and abrasion
  • Ensuring longevity and durability in demanding semiconductor environments
  • Chemical stability and resistance to corrosion.
  • Can be Machined to super high precision tolerances
  • Ensuring precise and reliable performance in semiconductor applications
  • Non-reactive with other materials used in semiconductor processes

 

Alumina Ceramic Base

 

99.5% Alumina Ceramic Parts Properties:

 Alumina Ceramic Material Properties
Properties Value
Main Composition Al2O3>99.5%
Density >3.95
Hardness (Gpa) 15~16
Room Temperature Electric Resistivity (Ω·cm) >10 14
Max Using Temperature(℃) 900.00
Three-Point Bending Strength (MPA) 450.00
Compressive Strength (MPA) 45.00
Young modulus (Gpa) 300-380
Thermal Expansion Coefficient(20-1000℃)(10-6/K) 6~8
Thermal Conductivity (W/m·k) 30.00
Dielectric strength(kv/mm) 18.00
Dielectric constant 9~10
Dielectric loss angle (*10-4) 2.00
Surface Roughness <Ra0.05um
Remark: The value is just for review, different using conditions will have a little difference.

 

The use of alumina ceramic parts in semiconductor process equipment, especially in implanters making alumina ceramic material to become an indispensable material in the semiconductor industry. Alumina implanter ceramic parts such as alumina ceramic base and alumina ceramic nozzles ensure the reliability, precision, and long service life of semiconductor manufacturing processes.

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