Hot pressed aluminum nitride ceramic is used in applications requiring high electrical resistivity in addition to exceptional thermal conductivity. The applications for hot-pressed AlN typically involve rigorous or abrasive environments and high-temperature thermal cycling.
Below are the properties of the pressed aluminum nitride.
| Property | Units | Value |
| Flexural Strength, MOR (20 °C) | MPa | 300-460 |
| Fracture Toughness | MPa m1/2 | 2.75-6.0 |
| Thermal Conductivity (20 °C) | W/m K | 80-100 |
| Coefficient of Thermal Expansion | 1 x 10-6/°C | 3.3-5.5 |
| Maximum Use Temperature | °C | 800 |
| Dielectric Strength (6.35mm) | ac-kV/mm | 16.0-19.7 |
| Dielectric Loss | 1MHz, 25 °C | 1 x 10-4 to 5 x 10-4 |
| Volume Resistivity (25°C) | Ω-cm | 1013 to 1014 |
The information provided on this chart is for general material property reference only.
Example Applications:
- Semiconductor heaters
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