Hot pressed aluminum nitride ceramic is used in applications requiring high electrical resistivity in addition to exceptional thermal conductivity. The applications for hot-pressed AlN typically involve rigorous or abrasive environments and high-temperature thermal cycling.
Below are the properties of the pressed aluminum nitride.
|Flexural Strength, MOR (20 °C)||MPa||300-460|
|Fracture Toughness||MPa m1/2||2.75-6.0|
|Thermal Conductivity (20 °C)||W/m K||80-100|
|Coefficient of Thermal Expansion||1 x 10-6/°C||3.3-5.5|
|Maximum Use Temperature||°C||800|
|Dielectric Strength (6.35mm)||ac-kV/mm||16.0-19.7|
|Dielectric Loss||1MHz, 25 °C||1 x 10-4 to 5 x 10-4|
|Volume Resistivity (25°C)||Ω-cm||1013 to 1014|
The information provided on this chart is for general material property reference only.
- Semiconductor heaters
- Ballistics armor
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