Innovacera supply the Porous ceramic Chuck Table which are mainly used to support and chuck the semiconductor wafer when grinding and dicing. It is applied in the process of thinning, dicing, clearance, transportation and so on.
Chuck Table Classification by applications：
Film Uncovered Chucks
Transportation Chucks(Backlit Chucks)
Thermal Wafer Chucks
Wire Bonding Chuck Tables
Electro Magnetic Dicing Chucks
Freezing Plate Chucks
Main Appication field:
–New, and refurbished, porous ceramic chucks for Disco ,ADT, K&S ,Applied materials TSK,OKAMOTO,Micro Automation,Load Point etc dicing saws and grinders.
–4″,5,6″,8,”12″ regular size available in round , square ,oval shape or irregular shapes and sizes.
–Custom size is available for us
1.High flatness and parallelism
2.Compact and uniform microstructure with high strength
3.Good permeability and uniform adsorption affinity
4.Long life time