Porous Ceramic Vacuum Chuck

Characteristics of porous ceramic vacuum chuck 1). Ceramic Material: SiC, Al2O3; Base material: stainless steel/aluminum alloy, ceramic, marble 2). Porous Ceramic Porosity: 40% 3). Porous Ceramic Pore Size: 1-100μm 4). Size customizat…

INNOVACERA ESD (Electro-Static Discharge) safe microporous ceramic vacuum chuck (black and dark brown) can be customized to provide high-performance suction and clamping for automated processing of film materials or visual inspection. It can meet…

Technical Ceramic Components are integral to semiconductor manufacturing equipment, technical ceramic components are high in purity with low levels of trace metals, this means they can constitute either the process chamber material or interior proces…

Vacuum chucks are used in the thinning, dicing, cleaning, handling, and other processes of semiconductor electronic chips, like wafers. Why choose microporous ceramic vacuum chucks? 1. During the polishing and cleaning process of wafers, polis…

The dicing vacuum chuck table can be made more than 12 inches, according to customer requirements with different shape like the disc, square and irregular shape. The size of thinning vacuum chuck can be matched with 3 inch wire, 4 inch wire, 5…

Porous ceramic chuck table is a so important part in semiconductor equipment such as silicon wafer processing. Porous Ceramic Vacuum Chucks are widely used as important components of equipment in silicon wafer, semiconductor compound wafer, pi…

The ceramic chuck table is applied to the fields of silicon wafer, semiconductor compound wafer, piezoelectric ceramic, glass, LED, semiconductor package component substrate, optical component thinning, cutting, and so on. Main Application fie…

Innovacera supply the Porous Ceramic Chuck Table which is mainly used to support and chuck the semiconductor wafer when grinding and dicing. It is applied in the process of thinning, dicing, clearance, transportation, and so on. Chuck Table Cl…