138 × 190 × 0.635 mm Aluminum Nitride Substrate

With excellent thermal conductivity,electrical insulation capability and dimensional stability,AlN substrates are widely used in power electronics,thermal management and semiconductor related applications.

Key Product Highlights

– Large format master sheet:138 × 190 mm panel size
– Thickness:0.635 mm
– Stable surface condition for metallization and processing
– Low warpage and good lot-to-lot consistency

Applications

– DPC Metallization: Full panel sputtering, plating and photolithography processes.
– Thick Film Processing: Screen printing, firing and laser trimming applications.
– Thin Film Processing: Deposition and patterning processes.
– DBC / AMB: Power electronic substrate manufacturing.
– Laser Cutting: Precision cutting into custom ceramic substrates.

Aluminum Nitride Ceramic Property:

Item		Testing Conditions	Unit	AlN
				AN-170
Material		–	–	AlN
Appearance		–	–	Light cyan
Surface Roughness		Ra	μm	0.1~0.75
Density		–	g/cm³	≥3.3
Physical Properties	Bending Strength	Three-Point Bending	MPa	≥400
	Vickers Hardness	Load of 4.9	GPa	≥1000 HV0.2
	Water Absorption Rate	–	%	–
Thermal Properties	Thermal Conductivity	25°C	W/(m·K)	≥170
	Linear Coefficient of Thermal Expansion	25°C-500°C	×10⁻⁶/°C	4~6
	Thermal Shock Resistance	800°C	Time	≥10
	Specific Heat	–	J/(kg·K)	720
Electrical Properties	Dielectric Constant	1 MHz / 25°C	–	8~9
	Dielectric Loss	1 MHz / 25°C	×10⁻⁴	≤3
	Volume Resistivity	25°C	Ω·cm	>10¹⁴
	Breakdown Voltage	–	kV/mm	>17
Optical Properties	Reflectance	Reflectance Meter	–	–
	Whiteness	Whiteness Meter	–	–

Why Choose INNOVACERA

INNOVACERA provides advanced ceramic materials and precision processing solutions for global industrial customers. Our engineering team supports material selection, surface requirements, dimensional control and customized ceramic solutions.

Contact INNOVACERA for aluminum nitride substrate selection, technical evaluation and customized ceramic solutions.