With excellent thermal conductivity,electrical insulation capability and dimensional stability,AlN substrates are widely used in power electronics,thermal management and semiconductor related applications.
Key Product Highlights
- Large format master sheet:138 × 190 mm panel size
- Thickness:0.635 mm
- Stable surface condition for metallization and processing
- Low warpage and good lot-to-lot consistency
Applications
- DPC Metallization: Full panel sputtering, plating and photolithography processes.
- Thick Film Processing: Screen printing, firing and laser trimming applications.
- Thin Film Processing: Deposition and patterning processes.
- DBC / AMB: Power electronic substrate manufacturing.
- Laser Cutting: Precision cutting into custom ceramic substrates.
Aluminum Nitride Ceramic Property:
| Item | Testing Conditions | Unit | AlN | |
| AN-170 | ||||
| Material | – | – | AlN | |
| Appearance | – | – | Light cyan | |
| Surface Roughness | Ra | μm | 0.1~0.75 | |
| Density | – | g/cm³ | ≥3.3 | |
| Physical Properties | Bending Strength | Three-Point Bending | MPa | ≥400 |
| Vickers Hardness | Load of 4.9 | GPa | ≥1000 HV0.2 | |
| Water Absorption Rate | – | % | – | |
| Thermal Properties | Thermal Conductivity | 25°C | W/(m·K) | ≥170 |
| Linear Coefficient of Thermal Expansion | 25°C-500°C | ×10⁻⁶/°C | 4~6 | |
| Thermal Shock Resistance | 800°C | Time | ≥10 | |
| Specific Heat | – | J/(kg·K) | 720 | |
| Electrical Properties | Dielectric Constant | 1 MHz / 25°C | – | 8~9 |
| Dielectric Loss | 1 MHz / 25°C | ×10⁻⁴ | ≤3 | |
| Volume Resistivity | 25°C | Ω·cm | >10¹⁴ | |
| Breakdown Voltage | – | kV/mm | >17 | |
| Optical Properties | Reflectance | Reflectance Meter | – | – |
| Whiteness | Whiteness Meter | – | – | |
Why Choose INNOVACERA
INNOVACERA provides advanced ceramic materials and precision processing solutions for global industrial customers. Our engineering team supports material selection, surface requirements, dimensional control and customized ceramic solutions.
Contact INNOVACERA for aluminum nitride substrate selection, technical evaluation and customized ceramic solutions.
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Frequently Asked Questions
What are the key specs of 138 × 190 × 0.635 mm AlN master sheets? How to order from a custom AlN substrate manufacturer?
The 138 × 190 × 0.635 mm Aluminum Nitride (AlN) master sheet (Grade AN-170) is designed for downstream ceramic processing with stable dimensional consistency and low warpage. Its key technical specifications include:
Which processing technologies use 138 × 190 mm Aluminum Nitride substrates? Why is AlN preferred for high-power thermal management?
Large format 138 × 190 × 0.635 mm AlN substrates are widely used in power electronics, semiconductor packaging, and thermal management, specifically for:
